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Since its establishment, the DOWA Group has evolved its operations in a number of directions in step with the changing times, to the extent of forging a unique recycling-oriented business structure.

The spectrum ranges from basic materials, semiconductor devices and process technologies, power electronic modules and components to complete power electronic and energy systems. Main target applications of the IISB are semiconductor manufacturing, electromobility, aerospace as well as sustainable energy supply. With its solutions, the institute has been setting benchmarks in energy efficiency and performance, even for extreme operating conditions. The integration of intelligent data-based functionalities also continuously opens up new application scenarios. Fraunhofer IISB supports its customers and partners worldwide in transferring scientific results into commercial products. Its activities are organized in two business areas: Semiconductor Technology and Power Electronic Systems. A total of around 400 employees works at the headquarters in Erlangen, Bavaria, at the Fraunhofer Technology Center High Performance Materials THM in Freiberg, Saxony and at the E|Road Center in Hallstadt.

Our development work is derived from the needs of the nine market-oriented business divisions – supplemented by strategic preliminary research at the highest scientific level.

It is our goal to develop complete system solutions and services, but also to solve specific challenges within the processes of our partners from industry and science. Our expertise in characterizing materials, components and systems along their life cycle provides us with a unique data pool to carry out new developments more efficiently and faster.

With state-of-the-art equipment on more than 40,000 m² of floor space, competent staff and result-oriented research management, we offer a contact point for companies and research partners to tap the unique properties of ceramic materials for new and improved applications.

The institute focuses on understanding the intricate relationships between production processes, operating conditions, and the resulting microstructural, material, and functional properties. 

Using advanced techniques such as non-destructive analysis, high-resolution electron microscopy, mechanical material characterization, and numerical simulation, Fraunhofer IMWS leads the way in failure diagnostics, process qualification, and degradation analysis. These efforts aim to enhance the reliability, quality, and efficiency of electronic systems throughout their entire lifecycle. 

In addition to power electronics, Fraunhofer IMWS supports industries such as automotive electronics and communication technologies, delivering fast, data-driven solutions. The institute’s state-of-the-art infrastructure and decades of expertise in material and failure diagnostics are complemented by micromechanical testing and simulation capabilities, enabling precise solutions to even the most complex challenges. 

What sets Fraunhofer IMWS apart is its customer-centric approach, flexibility, and speed in addressing industry needs. By accelerating innovation and reducing costs, the institute helps its partners improve product reliability and bring solutions to market faster. 

Visit our booth to learn how Fraunhofer IMWS can help you tackle the reliability challenges of power electronics and beyond!

The operating company develops sophisticated material solutions for the automotive industry, power electronics, and advanced packaging in development centers and production facilities in Asia, the USA, and Europe. As a solution provider, Heraeus Electronics offers its customers a broad product portfolio - from materials and material systems to components and services. 

InfraTec infrared sensor and measurement technology, founded in 1991, is headquartered in Dresden, Germany. The privately held company employs more than 240 employees and has its own design, manufacturing and distribution capabilities. 
With its infrared measurement business unit, InfraTec is one of the leading suppliers of commercial thermal imaging technology. In addition to the high-end camera series ImageIR® and the camera series TarisIR® and VarioCAM® High Definition, InfraTec offers turnkey thermographic automation solutions e.g. for industry processes, non-destructive testing and fire detection and prevention. 

Thermography in Electronics and Electrical Engineering 
The use of infrared thermography in electronics and electrical industry allows contactless measurement of surface temperatures with an infrared camera without contacting temperature sensors. It is an elegant, non-invasive optical temperature measurement method for simultaneous and temporally high-resolution detection of a number of measurement points. The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production. 

Everything in View with E-LIT InfraTec’s automated high-end testing system E-LIT allows non-contact defect inspection on semiconductor materials, electronic components, and electronic circuits. The Modular Test Bench provides online lock-in measurements with the highest sensitivity, supports 
integration of different camera technologies with detector formats up to (1,920 × 1,536) IR pixels, and enables complete, detailed microscopy analysis with geometric resolution up to 1.3 µm using microscopic lenses. Additionally, it offers thermal resolution in the microkelvin range, multi-layer analysis, and automatic scanning of larger samples through precision mechanics.

This includes the design, modelling and simulation as well as testing of novel components, frequency converters and drives as a whole. We will present the High Power Electronics-Laboratory (HiPE-LAB), which enables the testing of individual components or entire systems under realistic climatic and electrical conditions. Temperatures between -40 °C and +120 °C in combination with relative humidity from 10% to 95% and up to 10 MVA power-in-the-loop can be reached. By individual test profiles nearly all climatic zones on earth can be simulated. Additionally, we will show the latest version of the "M-Shunt", a low-inductance current sensor that is particularly well suited for circuits containing fast-switching wide band-gap semiconductors.

Additional bookings such as electricity, booth furnitures, booth cleaning, pinboards aso can be ordered separately.

We recommend to contract an insurance for dammages and loss.

Exhibitors have to respect the general rules of the venue during the event days.