Dr. F. Patrick McCluskey is a full Professor and Interim Chair of the Mechanical Engineering Department at the University of Maryland, College Park. He has over 30 years of research experience in the areas of thermal management, reliability, and packaging of electronic systems for use in harsh environments. Dr. McCluskey has co-authored three books, 5 US Patents, and approximately 200 peer-reviewed technical articles with over 5000 citations. He is a member of the board of governors of the IEEE Electronic Packaging Society, a fellow of IMAPS, winner of the 2025 IMAPS Outstanding Educator award, and a member of ASME, MRS, and ASEE.
VDE
Programme
CIPS 2026 - Conference programme
Some statements of the keynote and invited speakers
Dr. F. Patrick McCluskey, Dept. of Mechanical Engineering, University of Maryland, College Park, USA
Heterogeneous Integration requires efficient, clean, power distribution to multiple device functionalities at different voltages and currents. This requires miniaturized high performance power conversion units. These will combine novel high frequency materials and interconnection technologies with high breakdown voltage, thermally isolated substrates that contain integrated cooling technologies. Reliability of these devices is critical and relies on modeling thermal, fluidic, electrical, and thermomechanical processes and their failure mechanisms.
Heterogeneous Integration requires efficient, clean, power distribution to multiple device functionalities at different voltages and currents. This requires miniaturized high performance power conversion units. These will combine novel high frequency materials and interconnection technologies with high breakdown voltage, thermally isolated substrates that contain integrated cooling technologies. Reliability of these devices is critical and relies on modeling thermal, fluidic, electrical, and thermomechanical processes and their failure mechanisms.
Prof. em. Dr. Johann W. Kolar - Advanced Mechatronic Systems Group ETH Zurich, Switzerland
Integration is a fundamental driver of innovation across all hierarchical levels of power-electronics functional elements and encompasses not only hardware but also software and control domains. When viewed in a broader context, integration must reconcile three competing requirements: ultra-compact implementations of units with specific functionality, low costs and economies of scale enabled by standardization, and, crucially, dismantlability at the end of life. The latter is essential to enable repair, refurbishment, and recycling, thereby ensuring compatibility with a future circular economy. This perspective aligns with Power Electronics 5.0, which represents the next evolutionary stage in the development of power electronics.
Integration is a fundamental driver of innovation across all hierarchical levels of power-electronics functional elements and encompasses not only hardware but also software and control domains. When viewed in a broader context, integration must reconcile three competing requirements: ultra-compact implementations of units with specific functionality, low costs and economies of scale enabled by standardization, and, crucially, dismantlability at the end of life. The latter is essential to enable repair, refurbishment, and recycling, thereby ensuring compatibility with a future circular economy. This perspective aligns with Power Electronics 5.0, which represents the next evolutionary stage in the development of power electronics.
Johann W. Kolar received his M.Sc. and Ph.D. degrees (summa cum laude – promotio sub auspiciis praesidentis rei publicae) from the University of Technology Vienna, Austria. After spending 15 years as an international consultant and independent researcher, he was appointed Associate Professor and Head of the Power Electronic Systems Laboratory at the Swiss Federal Institute of Technology (ETH) Zurich in 2001 and was promoted to Full Professor in 2004. Over the course of his career, he has proposed numerous novel converter concepts, including the Vienna Rectifier, spearheaded the development of x-million-rpm motors, and pioneered fully automated, multi-objective power electronics design procedures. He has personally supervised more than 90 Ph.D. students to completion, has extensively published in IEEE Transactions, is named as inventor on numerous granted patents, and has received several prestigious awards, including the 2016 IEEE William E. Newell Power Electronics Award, the 2025 IEEE Medal in Power Engineering, and two ETH Zurich Golden Owl Awards for excellence in teaching. As Professor Emeritus (since August 2024), he actively continues to pursue research in ultra-compact and highly efficient wide-bandgap (WBG) converter systems, AI and machine learning applications in power electronics, solid-state transformers, and the life cycle analysis of power electronic converter systems. He is an International Member of the U.S. National Academy of Engineering (NAE), a Fellow of the National Academy of Inventors (NAI), and an IEEE Life Fellow.
Prof. Dr. Thomas Ebel - CIE South Danish University, Denmark
Capacitors are everywhere and reliability of the devices was and is a hot topic. Better lifetime models are required. My talk addresses the physics and chemistry of failure modes of aluminum electrolytic and metallized film capacitors as a new hybrid mode using data driven models boosted by machine learning and AI.
Dr. Jacek Rudzki - Semikron Danfoss, Germany
Reliability in power electronics is an important factor in producing the best power modules. With All Copper Technology, it is possible to achieve high reliability in combination with SiC devices.
Dr.-Ing. Jan Albrecht - Technical University Chemnitz, Germany
Advanced packaging technologies, such as embedding, can significantly improve reliability while increasing power density, as demonstrated by the HiEFFICIENT project for GaN and SiC power components.
Prof. Dr.-Ing. Sibylle Dieckerhoff - Technical University Berlin, Germany
The presentation discusses integration solutions for 600V class GaN power transistors using devices based on a GaN-on-AlN/SiC platform developed at FBH Berlin. The monolithic half-bridges and monolithic bidirectional transistors show good immunity to back-gating and fast switching transients. Their functionality is demonstrated in basic dc-dc-converter- and T-Type inverter operation.
Ali Benzehra - Schaeffler, France
I’m excited to share my enthusiasm for EMC investigation and innovative noise reduction techniques that help improve the performance and power density of power electronic systems.
Invited Speaker
CIPS 2026 Conference Dinner at the Pulverturm Dresden – An Evening of Royal Splendor
RS.plus / diamonds network
Step into history and experience an unforgettable night at the iconic Pulverturm Dresden! The CIPS 2026 Conference Dinner will transport you to the magnificent Baroque era. None other than "August the Strong" himself will accompany you on this journey, bringing the grandeur and elegance of his court to life.
Indulge in a gourmet menu in a setting steeped in tradition, surrounded by tales of Saxon royalty. Let the majestic atmosphere inspire meaningful conversations and create lasting connections in a venue where history meets modern networking.
VDE Conferences App – Always One Step Ahead
© VDE
All participants of our event will have access to the VDE Conferences App. This allows them to retrieve all relevant information and materials directly on their smartphone or tablet. The app offers a user-friendly interface that enables participants to quickly navigate the program, select exciting presentations, and actively engage in sessions.
The benefits of the VDE Conferences App at a glance:
- Interactive Agenda: Participants can create their personal schedule, select sessions and presentations, and receive reminders for their favorite events.
- Networking Opportunities: Integrated features allow participants to connect, use chat functions, and exchange ideas based on shared interests.
- Live Updates: Real-time information on program changes, important announcements, and events is provided.
- Documentation and Materials: Access to presentations, scientific papers, and additional resources to foster knowledge sharing.
- Feedback and Surveys: Participants can share their opinions on presentations and workshops directly through the app, supporting continuous improvement of the event.
The VDE Conferences App will be sent to participants shortly before the event.
