CIPS Int. Conference on Integrated Power Electronics Systems

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS - is consequently focused on the following main aspects:

assembly and interconnect technology for power electronic devices and converters
integration of hybrid systems and mechatronic systems with high power density
systems‘ and components‘ operational behavior and reliability

Basic technologies for integrated power electronic systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.

In 2022 the successful story of CIPS will continue as the conference focus is today more important than ever – increasing functionality, energy efficiency and system reliability while decreasing cost.

We thank all authors who responded to the call for papers and registered a contribution. Now these contributions will be evaluated and the preliminary conference program will be compiled.

We also offer you the possiblity to book an exhibition space and present your products to the community of CIPS. The exhibition will take place in the foyer of the event hotel.

We are looking forward to welcoming you 2022 in Berlin!

In 2022 the successful story of CIPS will continue as the conference focus is today more important than ever – increasing functionality, energy efficiency and system reliability while decreasing cost.

The final programme is available now!

Thomas Harder, Leo Lorenz, ECPE

Thomas Harder, Leo Lorenz, ECPE
General Chairmen

Nando Kaminski, University of Bremen; Andreas Lindemann, Otto-von-Guericke-University Magdeburg

| VDE

Nando Kaminski, University of Bremen; Andreas Lindemann, Otto-von-Guericke-University Magdeburg
Technical Program Chairmen

Accommodation

A wide variety of hotel rooms in various categories have been prereserved via the hotel agency.

If you wish to stay in the conference venue MERCURE HOTEL MOA BERLIN please contact the hotel directly. Use the booking Code “CIPS 2022” (Room Price 134,- EUR incl. breakfast per night/person).

We have also blocked rooms in other hotels close to the venue hotel via our partner smart and more GmbH.

Venue

Distances

Main railway station: 2.5 km
Motorway: 2.5 km
Airport Berlin-Tegel: 6 km
Airport Berlin-Schönefeld : 26 km

Prices and Transportation

Taxi fares

From airport Berlin Tegel: approx. 15-20 €
From airport Berlin Schönefeld: approx. 50-60 €
From main station: approx. 5-10 €

Busses and trams

From airport Berlin Tegel:
"Bus TXL" in direction to S+U Alexanderplatz to stop "Turmstraße", take "Bus M27" in direction to S+U Pankow to stop "Havelbergerstraße". You reach "Mercure Hotel MOA Berlin" after a footpath of 5 minutes.
From main station:
tramway S5 in direction to "Westkreuz", S3 or S75 in direction to "Spandau" to stop "Zoologischer Garten"
from "Zoologischer Garten" take the tramway U9 in direction to "Osloer Straße" to stop "Birkenstraße". You reach "Mercure Hotel MOA Berlin" after a footpath of 100 meters.

Car

In "Mercure Hotel MOA Berlin" there is a parking space with a capacity of 550 places.

Target Audience

We invite all engineers coming from industry and academia engaged in power electronics-related

system development
component development
reliability engineering
research

to learn more about the latest research and technical achievements by joining CIPS.

Conference Topics

Power Packages and Modules
Components to be integrated
Power Packages and Modules/Mechatronic Systems
General Aspects of Packaging
Clean Switching, EMC
Reliability

Committee Members

Board of Directors

Thomas Harder, ECPE e.V. (General Chair)
Leo Lorenz, ECPE e.V. (General Chair)

Nando Kaminski, University of Bremen (Technical Chair)
Johann Walter Kolar, ETH Zentrum
Andreas Lindemann, Otto-von-Guericke-University Magdeburg (Technical Chair)
Thomas Raphael, VDE e.V.
Dieter Silber, University of Bremen
Eckhard Wolfgang, ECPE e.V.

Topic Group Chairs

Clean switching, electromagnetic compatibility (EMC)
Reinhold Bayerer, DE
Jean-Luc Schanen, Grenoble Electrical Engineering Laboratory, FR

Components to be integrated & Mechatronic systems and their applications
Cyril Buttay, Université de Lyon Laboratoire Ampere CNRS UMR 5005, FR
Regine Mallwitz, Technische Universität Braunschweig, DE

General aspects of packaging & Power packages and modules
Guo-Quan Lu, Virginia Tech, USA
Jürgen Wilde, Albert-Ludwigs-Universität Freiburg, DE

Reliability
Norbert Seliger, FH Rosenheim, DE
Eckhard Wolfgang, ECPE e. V., DE

Organizing Committee

Hatice Altintas, VDE Conference Services
Ingrid Bollens, European Center for Power Electronics (ECPE e.V.)
Thomas Harder, European Center for Power Electronics (ECPE e.V.)
Andreas Lindemann, Otto-von-Guericke-University Magdeburg
Nando Kaminski, University of Bremen
Thomas Raphael, VDE ETG

Exhibition

The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates.

The exhibition is the communicative core of the conference. Manufacturers and service provides present future and praxis oriented applications and products.

Exibition

Downloads

Awards

The CIPS Best Poster Award is granted at each CIPS for an outstanding poster presentation. The technical content and general structure of both the paper and the poster are evaluated.

ECPE also presents the ECPE Young Engineer Award. In order to be considered for this Award, the candidates have to be under 35 at the first conference day.

Organisers + Contact

For all questions regarding the conference participation, the preparation of lectures, posters, conference proceedings, the organization of the exhibition, etc., please contact the VDE Conference Service.