CIPS 2024 | 12. - 14. March | Düsseldorf, Germany


CIPS - International Conference on Integrated Power Electronics Systems

In the next decades, power electronic system develop­ ment will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will comprise advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS is consequently focused on the following main aspects:

  • assembly and interconnect technology for power electronic devices and converters
  • integration of hybrid systems and mechatronic systems with high power density
  • systems‘ and components‘ operational behaviour, reliability and availability

Basic technologies for integrated power electronic systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.

In 2024 the successful story of CIPS will continue as the conference‘s focus is today more important than ever – increasing functionality, energy efficiency and system reliability while decreasing cost.

Call for Papers

We invite all engineers and scientists coming from industry and academia engaged in power electronics­  related

  • system development 
  • component development 
  • reliability engineering 
  • basic and applied research

to share their research and technical achievements joining CIPS 2024.

Together with the TPC Members, we invite you to present your latest research in submitting a paper for oral or poster presentation.

We also offer you the possiblity to book an exhibition space and present your products to the community of CIPS. The exhibition will take place in the foyer of the event hotel.

We are looking forward to welcoming you 2024 in Düsseldorf!

We are very happy that the power electronics community could meet again at CIPS 2022 after a break of four years. The 150 participants and 10 exhibitors on site in Berlin and the 100 participants online enjoyed the event very much. We would like to thank all the attendees for their fruitful discussions during the sessions, the dialogue session and the within exhibition.

We hope to see you all in person at the next anniversary: 30 years of CIPS - March 12-14, 2024, Düsseldorf / Germany.

If you wish to have further information on these topics, you will find very soon the report and pictures of the event on the homepage.

Additionally participants will be able to download the presentations and posters from a password protected link.

You could not attend ?

All the contributions are included in the proceedings and published from VDE publishing house.

Thomas Harder, Leo Lorenz, ECPE

Thomas Harder, Leo Lorenz, ECPE
General Chairmen

Nando Kaminski, University of Bremen; Andreas Lindemann, Otto-von-Guericke-University Magdeburg


Nando Kaminski, University of Bremen; Andreas Lindemann, Otto-von-Guericke-University Magdeburg
Technical Program Chairmen

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Conference topics

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Applications are wide spread over areas such as

  • transportation: automotive, railway, aircraft
  • power electronics in the grid, in particular for renewable energy: wind, solar ...
  • drives and power supplies

1. Components to be integrated

  • advanced silicon devices and monolithic integration
  • wide bandgap devices and monolithic integration
  • gate drivers
  • passive components
  • sensors and actuators

2. General aspects of packaging

  • system and component packaging
  • assembly concepts, embedded power, 3D integration
  • new materials incl. interface materials and interconnects
  • additive manufacturing
  • high voltage insulation
  • design for high temperature applications
  • cooling concepts
  • multidomain CAD and design tools

3. Power packages and modules

  • bare chip packaging
  • discrete semiconductor packages
  • hermetic semiconductor packages
  • power semiconductor modules
  • heterogeneous integration, power system­in­package

4. System and application aspects

  • mechatronic systems and their applications
  • integration of power electronics into electric machines
  • challenges of fast switching on circuit/system level winding insulation, bearin currents, earth leakage, touch current, ...
  • integration with sensors and actuators
  • overall system optimisation

5. Reliability and availability

  • reliability requirements, mission profiles
  • robustness validation, physics of failure, failure analysis
  • modelling and simulation of lifetime
  • intelligent reliability testing
  • prognostics and health management
  • fault tolerant designs and applications

6. Clean switching, electromagnetic compatibility (EMC)

  • parasitics optimization: electromagnetically optimized design
  • oscillation free design
  • symmetric paralleling of power semiconductors
  • design of drivers for improved switching waveforms
  • EMC interferences reductions: optimized control, active filter and passive filter design
  • EMI filter integrations: material, component design, implementation
  • integrated sensors and high bandwidth measurement 

Please select the most appropriate topic for your contribution. The other topics are possible examples. Please submit your contribution even if you can not find the appropriate topic for your contribution. All interesting contributions are welcome!

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Target Audience

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We invite all engineers coming from industry and academia engaged in power electronics-related

  • system development
  • component development
  • reliability engineering
  • research

to learn more about the latest research and technical achievements by joining CIPS.


By Plane  

  • Düsseldorf Airport is located just three kilometres from CCD Congress Center Düsseldorf.
  • For taxi journeys from Düsseldorf Airport to all Messe Düsseldorf entrances or vice versa, a special fare of EUR 20 applies day and night. Depending on prevailing traffic, the journey takes approx. 10-15 minutes.
  • There is also a direct shuttle service by bus 896 from the airport to the trade fair or congress centre during trade fairs.

By Train

  • CCD Congress Center Düsseldorf can be easily reached from Düsseldorf railway station (Düsseldorf HBF) by underground or bus.
  • Bus 722 will take you from Düsseldorf railway station to the congress center in about 30 minutes.
  • Take the underground U78 (from the city centre) or the U79 (from the city centre, Kaiserswerth, Wittlaer and Duisburg) to the Messe Ost/Stockumer Kirchstraße stop. From there you can reach CCD Congress Center Düsseldorf on foot, via Stockumer Kirchstraße, in approx. 15 minutes or take the 722 bus to the final stop Messe Congress Center.
  • Information on timetables, train and bus lines as well as tickets can be obtained from the Rheinbahn.
  • Search for connection with Deutsche Bahn

By Car

CCD Congress Center Düsseldorf can be reached from the north via the A52 and A3 motorways, from the west via the A44 and A57 and from the south via the A57 and A59.

Input data for satnavs:
Rotterdamer Strasse at the intersection to Stockumer Kirchstrasse
40474 Düsseldorf, Germany

In the immediate vicinity of the Congress Center, follow the dedicated signposting to CCD Stadthalle, CCD Süd or CCD Ost or the parking signs.

CCD Congress Center Düsseldorf
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A wide variety of hotel rooms in various categories have been prereserved via the hotel agency.

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A wide variety of hotel rooms in various categories have been prereserved via the hotel agency.

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Committee Members

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Board of Directors

Thomas Harder, ECPE e.V. (General Chair)
Leo Lorenz, ECPE e.V. (General Chair)

Nando Kaminski, University of Bremen (Technical Chair)
Johann Walter Kolar, ETH Zürich
Andreas Lindemann, Otto-von-Guericke-University Magdeburg (Technical Chair)
Dieter Silber, University of Bremen
Eckhard Wolfgang, ECPE e.V.

Topic Group Chairs

Clean switching, electromagnetic compatibility (EMC)
Reinhold Bayerer, DE
Jean-Luc Schanen, Grenoble Electrical Engineering Laboratory, FR

Components to be integrated & Mechatronic systems and their applications
Cyril Buttay, Université de Lyon Laboratoire Ampere CNRS UMR 5005, FR
Regine Mallwitz, Technische Universität Braunschweig, DE

General aspects of packaging & Power packages and modules
Shiori Idaka, Mitsubishi Electric Europe, DE
Guo-Quan Lu, Virginia Tech, USA
Jürgen Wilde, Albert-Ludwigs-Universität Freiburg, DE

Norbert Seliger, FH Rosenheim, DE
Eckhard Wolfgang, ECPE e. V., DE

Organizing Committee

Judith Sanders, Conference Services (VDE e.V.)
Ingrid Bollens, European Center for Power Electronics (ECPE e.V.)
Thomas Harder, European Center for Power Electronics (ECPE e.V.)
Andreas Lindemann, Otto-von-Guericke-University Magdeburg
​Nando Kaminski, University of Bremen
Thomas Raphael, VDE ETG

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The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates.

Icon Ausstellung

The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates.

The exhibition is the communicative core of the conference. Manufacturers and service provides present future and praxis oriented applications and products.

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The proceedings will be published by VDE Publishing House.

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The proceedings will be published by VDE Publishing House.

All the accepted papers will be published as proceedings (limited edition).

A few months after the conference, the papers will be available for purchase as single pdf file.

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The CIPS Best Poster Award is granted at each CIPS for an outstanding poster presentation. The technical content and general structure of both the paper and the poster are evaluated.

Icon Erhöhung Qualität

The CIPS Best Poster Award is granted at each CIPS for an outstanding poster presentation. The technical content and general structure of both the paper and the poster are evaluated.

ECPE also presents the ECPE Young Engineer Award. In order to be considered for this Award, the candidates have to be under 35 at the first conference day.

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Organisers + Contact

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For all questions regarding the conference participation, the preparation of lectures, posters, conference proceedings, the organization of the exhibition, etc., please contact the VDE Conference Service.

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Past Events

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You can find information about the past events here on the website.

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Direct Link:

Picture: Sarah Rugen + (center module) Semikron