CIPS - International Conference on Integrated Power Electronics Systems

Applications are wide spread over areas such as power supplies  
and drives

• to feed all kinds of loads – consumer electronics, industrial equipment, data centres, ...
• from the grid or to feed electrical energy from solar or wind generators to the grid
• for transportation – railway, automotive, aircraft

1. Components to be integrated

• advanced silicon devices and monolithic integration
• wide bandgap devices and monolithic integration
• gate drivers
• passive components
• sensors and actuators

2. General aspects of packaging

• system and component packaging
• assembly concepts, embedded power, 3D integration
• new materials incl. interface materials and interconnects
• additive manufacturing
• high voltage insulation
• design for high temperature applications
• cooling concepts
• multidomain CAD and design tools

3. Power packages and modules

• bare chip packaging
• discrete semiconductor packages
• hermetic semiconductor packages
• power semiconductor modules
• heterogeneous integration, power system­in­package

4. System and application aspects

• mechatronic systems and their applications
• integration of power electronics into electric machines
• challenges of fast switching on circuit/system level winding insulation, bearing currents, earth leakage, touch current, ...
• integration with sensors and actuators
• overall system optimisation

5. Reliability and availability

• reliability requirements, mission profiles
• intelligent reliability testing
• modelling and simulation of lifetime
• prognostics and health management
• robustness validation, testing for abnormal conditions and related modeling
• physics of failure, failure analysis
• fault tolerant designs and applications

6. Design for high frequency and electromagnetic compatibility

• high and very high frequency power electronics
• characterisation and optimisation of layout and device parasitics 
• reduction of electromagnetic interference: optimised control, 
• integration and shielding, active and passive EMI filters
• integrated sensors, high frequency measurement techniques
• high frequency modelling, simulation and control of power electronic devices and circuits

Please select the most appropriate topic for your contribution. The other topics are possible examples. Please submit your contribution even if you can not find the appropriate topic for your contribution. All interesting contributions are welcome!

We invite all engineers coming from industry and academia engaged in power electronics-related

• System development
• Component development
• Reliability engineering
• Basic and applied research

to learn more about the latest research and technical achievements by joining CIPS.

Airport Dresden DRS

• take the S-Bahn line S2 in the direction of Heidenau and leave the train at Dresden-Neustadt station
• Walking distance approx. 900m: Leave the station building in the direction of Neustadt and keep right. Cross the Antonstraße in front of you and turn straight into the Hainstraße. At Palaisplatz cross Große Meißner Straße at the level of the fountain. The hotel is on the left-hand side.

Train Dresden Hbf (main station)

• Exit Dresden Hauptbahnhof Nord stop
• take tram no. 9 in the direction of Kaditz. Leave the tram at Neustädter Markt in the direction of travel (travel time approx. 8 min).
• The entrance to the hotel is after 100m on the Große Meissner Straße.

Taxi

• Train Dresden main station 10min.
• Train Dresden-Neustadt 5min.
• Dresden Airport DRS 20min.

The indicated travel times are approximate and can vary greatly depending on the traffic situation.

Car

• Address for navigation devices: Große Meißner Straße 15, 01097 Dresden, Germany
• Parking: 160 parking spaces directly in front of the hotel (24€ per day).

Dresden Tourism

Explore Dresden and choose from a wide range of attractive packages and travel programmes. 

Dresden tourism offers trips and guided tours as well museum and opera tickets. Have a look on the website and book your tours online.

Conference Chairmen

• Thomas Harder, ECPE e.V. (General Chair)
• Leo Lorenz, ECPE e.V. (General Chair)
• Nando Kaminski, University of Bremen (Technical Chair)
• Johann Walter Kolar, ETH Zürich
• Andreas Lindemann, Otto-von-Guericke-University Magdeburg (Technical Chair)
• Dieter Silber, University of Bremen
• Eckhard Wolfgang, ECPE e.V.

Topic chairpersons

Topic 1 - Components to be integrated

• Cyril Buttay, Université de Lyon Laboratoire Ampere CNRS UMR 5005, FR
• Regine Mallwitz, Technische Universität Braunschweig, DE

Topic 2 - General aspects of packaging 

• Shiori Idaka, Mitsubishi Electric Europe, DE
• Guo-Quan Lu, Virginia Tech, USA
• Jürgen Wilde, Albert-Ludwigs-Universität Freiburg, DE

Topic 3 - Power packages and modules

• Shiori Idaka, Mitsubishi Electric JP/DE
• Guo-Quan Lu, Virginia Tech, USA
• Jürgen Wilde, University of Freiburg, DE

Topic 4 - System and application aspects      

• Cyril Buttay, Université de Lyon Laboratoire Ampere CNRS UMR 5005, FR
• Regine Mallwitz, Technische Universität Braunschweig, DE

Topic 5 - Reliability and availability

• Francesco Ianuzzo, Politecnico di Torino, IT
• Norbert Seliger  Rosenheim Technical University of Applied Sciences, DE
• Eckhard Wolfgang, ECPE e.V., DE

Topic 6 - Design for high frequency and electromagnetic compatibility

• Ingmar Kallfass  University of Stuttgart
• Jean-Luc Schanen, Grenoble Electrical Engineering Laboratory, FR

Organising committee

• Thomas Harder, European Center for Power Electronics (ECPE e.V.)
• Andreas Lindemann, Otto-von-Guericke-University Magdeburg
• ​Nando Kaminski, University of Bremen
• Thomas Raphael, VDE ETG
• Nicolas Parisel, VDE Conference Service, VDE e.V.

The exhibition is the communicative core of the conference. Manufacturers and service provides present future and praxis oriented applications and products.

All the accepted papers will be published as proceedings (limited edition).

A few months after the conference, the papers will be available for purchase as single pdf file.

For all questions regarding the conference participation, the preparation of lectures, posters, conference proceedings, the organization of the exhibition, etc., please contact the VDE Conference Service.

You can find information about the past events here on the website.