Chairmen's Welcome Message
We are very pleased to welcome all of you to the 11th International Conference on Integrated Power Electronics Systems (CIPS). Due to the COVID-19 situation this year, we were unfortunately not allowed to run the usual open conference we all appreciate most and have needed to go a different way. As we had to cancel the live meeting at a very late stage, so close to our scheduled conference start, all authors had already written their articles and prepared their presentations. We have therefore decided to publish these papers in all media as per previous years. This continues to allow all authors to enjoy the full benefits of distributing their articles to the power electronics community. To maximise these benefits to the conference participants, we have also installed an online forum with media tool to offer open discussion with the authors. In this exceptional year that we face, we take full advantage of the “digitalisation" of our world by publishing the full papers on the well-known VDE Verlag and library, as well as in IEEE Xplore in addition to digital communication in the forum. The papers can also be submitted to the IEEE Transactions on Power Electronics for inclusion upon review.
Over the last 20 years the CIPS Conference has developed into a key platform for the exchange of information and expert discussion among R & D engineers from industry and academia engaged in all aspects of power electronic system integration, the application of advanced power devices based on Si and WBG material including new packaging technologies and mechatronic integration.
CIPS 2020 is organised by VDE / ETG in cooperation with ECPE - the European Center for Power Electronics and is co-sponsored by IEEE PELS and ZVEI.
In addition to four keynotes and seven invited papers, the program for this year's conference includes 18 oral sessions with 64 presentations and one poster session divided into 6 tracks with 43 poster presentations.
The keynotes and invited papers, authored by top experts coming from industrial and academic organisations of worldwide importance, are presenting the latest developments in the various aspects of embedded power integration, WBG technologies, SMART integrated passives, power converter design for extremely high power densities, packaging technologies and related reliability aspects, with particular attention to the latest results achieved in the main research centers in America, Asia, and Europe.
It is important to mention that in contrast to other mainstream power electronics conferences, the focus of CIPS 2020 also includes reliability issues, wide band gap devices and packaging - including the management of parasitics, chip interfacing technologies, substrates and interconnects.
We hope that you are able to use this conference to broaden your knowledge of the associated topics as a means of advancing your professional career. On behalf of everyone involved in the organisation, we express our thanks to the members of the CIPS 2020 organising committee, especially including T. Raphael and H. Altintas from VDE and I. Bollens from ECPE for all the work they have done to guide this conference to a great success. Special thanks also go to our honorary chairs D. Silber and E. Wolfgang for their outstanding support and finally all the authors and TPC members for their valuable work making the CIPS possible as a well-known scientific conference.
