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CIPS 2022 | 15. - 17. March 2022 | Berlin, Germany
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Mercure Hotel MOA Berlin
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In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS -  is consequently focused on the following main aspects:

  • assembly and interconnect technology for power electronic devices and converters
  • integration of hybrid systems and mechatronic systems with high power density
  • systems‘ and components‘ operational behavior and reliability

Basic technologies for integrated power electronic systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.

In 2022 the successful story of CIPS will continue as the conference focus is today more important than ever – increasing functionality, energy efficiency and system reliability while decreasing cost.

We thank all authors who responded to the call for papers and registered a contribution. Now these contributions will be evaluated and the preliminary conference program will be compiled.

We also offer you the possiblity to book an exhibition space and present your products to the community of CIPS. The exhibition will take place in the foyer of the event hotel.

We are looking forward to welcoming you 2022 in Berlin!

Thomas Harder, Leo Lorenz, ECPE

Thomas Harder, Leo Lorenz, ECPE
General Chairmen

Nando Kaminski, University of Bremen; Andreas Lindemann, Otto-von-Guericke-University Magdeburg

| VDE

Nando Kaminski, University of Bremen; Andreas Lindemann, Otto-von-Guericke-University Magdeburg
Technical Program Chairmen

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Accommodation

A wide variety of hotel rooms in various categories have been prereserved via the hotel agency.
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A wide variety of hotel rooms in various categories have been prereserved via the hotel agency.

If you wish to stay in the conference venue MERCURE HOTEL MOA BERLIN please contact the hotel directly. Use the booking Code “CIPS 2022” (Room Price 134,- EUR incl. breakfast per night/person).

We have also blocked rooms in other hotels close to the venue hotel via our partner smart and more GmbH.

Accommodation

Mercure Hotel MOA Berlin
smart and more GmbH

Venue

Distances 

  • Main railway station:  2.5 km
  • Motorway:  2.5 km
  • Airport Berlin-Tegel:  6 km
  • Airport Berlin-Schönefeld : 26 km

Prices and Transportation 

Taxi fares

  • From airport Berlin Tegel: approx. 15-20 €
  • From airport Berlin Schönefeld: approx. 50-60 €
  • From main station: approx. 5-10 €

Busses and trams

  • From airport Berlin Tegel:
    "Bus TXL" in direction to S+U Alexanderplatz to stop "Turmstraße", take "Bus M27" in direction to S+U Pankow to stop "Havelbergerstraße". You reach "Mercure Hotel MOA Berlin" after a footpath of 5 minutes.
  • From main station:
    tramway S5 in direction to "Westkreuz",  S3 or S75 in direction to "Spandau" to stop "Zoologischer Garten"
    from "Zoologischer Garten" take the tramway U9 in direction to "Osloer Straße" to stop "Birkenstraße". You reach "Mercure Hotel MOA Berlin" after a footpath of 100 meters.

Car

In "Mercure Hotel MOA Berlin" there is a parking space with a capacity of 550 places. 

Mercure Hotel MOA Berlin
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Target Audience
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We invite all engineers coming from industry and academia engaged in power electronics-related

  • system development
  • component development
  • reliability engineering
  • research

to learn more about the latest research and technical achievements by joining CIPS.

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Conference topics

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Applications are wide spread over areas such as

  • transportation: automotive, railway, aircraft
  • power electronics in the grid, in particular for renewable energy: wind, solar ...
  • drives and power supplies

 

1. Components to be integrated

  • advanced silicon devices and monolithic integration
  • wide bandgap devices and monolithic integration
  • gate drivers
  • passive components
  • sensors and actuators

2. General aspects of packaging

  • system and component packaging
  • assembly concepts, embedded power, 3D integration
  • new materials and interconnects
  • additive manufacturing
  • high voltage insulation
  • design for high temperature applications
  • cooling concepts
  • interface materials
  • multi­domain CAD (electrical, thermal, mechanical, chemical) as design tool

3. Power packages and modules

  • bare chip packaging
  • discrete semiconductor packages
  • hermetic semiconductor packages
  • power semiconductor modules
  • heterogeneous integration, power system­-in­-package

4. System and application aspects

  • mechatronic systems and their applications
  • integration of power electronics into electric machines
  • challenges of fast switching on circuit/system level - winding insulation, bearing currents, earth leakage, touch current, ...
  • integration with sensors and actuators
  • overall system optimisation

5. Reliability and Availability

  • reliability requirements, mission profiles
  • robustness validation, physics of failure, failure analysis,
  • modelling and simulation of lifetime
  • intelligent reliability testing
  • prognostics and health management
  • fault tolerant designs and applications

6. Clean switching, electromagnetic compatibility (EMC)

  • parasitics and interferences; design for low inductance, coupling capacity
  • electrodynamically optimised design
  • optimised control through driving scheme filters

 

Please select the most appropriate topic for your contribution. The other topics are possible examples. Please submit your contribution even if you can not find the appropriate topic for your contribution. All interesting contributions are welcome!

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Committee Members
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Board of Directors

Thomas Harder, ECPE e.V. (General Chair)
Leo Lorenz, ECPE e.V. (General Chair)

Nando Kaminski, University of Bremen (Technical Chair)
Johann Walter Kolar, ETH Zentrum
Andreas Lindemann, Otto-von-Guericke-University Magdeburg (Technical Chair)
Thomas Raphael, VDE e.V.
Dieter Silber, University of Bremen
Eckhard Wolfgang, ECPE e.V.


Topic Group Chairs

Clean switching, electromagnetic compatibility (EMC)
Reinhold Bayerer, DE
Jean-Luc Schanen, Grenoble Electrical Engineering Laboratory, FR

Components to be integrated & Mechatronic systems and their applications
Cyril Buttay, Université de Lyon Laboratoire Ampere CNRS UMR 5005, FR
Regine Mallwitz, Technische Universität Braunschweig, DE

General aspects of packaging & Power packages and modules
Guo-Quan Lu, Virginia Tech, USA
Jürgen Wilde, Albert-Ludwigs-Universität Freiburg, DE

Reliability
Norbert Seliger, FH Rosenheim, DE
Eckhard Wolfgang, ECPE e. V., DE


Organizing Committee

Hatice Altintas, VDE Conference Services
Ingrid Bollens, European Center for Power Electronics (ECPE e.V.)
Thomas Harder, European Center for Power Electronics (ECPE e.V.)
Andreas Lindemann, Otto-von-Guericke-University Magdeburg
​Nando Kaminski, University of Bremen
Thomas Raphael, VDE ETG

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Exhibition

The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates.

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The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates.

The exhibition is the communicative core of the conference. Manufacturers and service provides present future and praxis oriented applications and products.

Exibition
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Downloads

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Downloads + Links
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Awards

The CIPS Best Poster Award is granted at each CIPS for an outstanding poster presentation. The technical content and general structure of both the paper and the poster are evaluated.
Icon Erhöhung Qualität

The CIPS Best Poster Award is granted at each CIPS for an outstanding poster presentation. The technical content and general structure of both the paper and the poster are evaluated.

ECPE also presents the ECPE Young Engineer Award. In order to be considered for this Award, the candidates have to be under 35 at the first conference day.

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Organisers + Contact
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For all questions regarding the conference participation, the preparation of lectures, posters, conference proceedings, the organization of the exhibition, etc., please contact the VDE Conference Service.

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Past Events

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You can find information about the past events here on the website.

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ETG Workshop Circuit Technology for GaN Devices in Power Electronics

Ausschaltvorgang eines 650V GaN-HEMT(c) Professur Leistungselektronik - Helmut-Schmidt-Universität

The day before CIPS, this workshop will take place in the same hotel as CIPS. Please note: Language german.

GaN components have undergone rapid development in recent years and are becoming more and more established in applied power electronics. Meanwhile, power semiconductor devices from various manufacturers are commercially available in different designs and technologies as well as voltage and current classes and are on their way to application.

More and more users are investing in research and development to exploit the potential of fast GaN semiconductor switches for their systems. This raises many questions about suitable transistor technology, optimal circuit topologies, gate driver units and practical implementation, for example with regard to construction and integration techniques or EMC. In addition to the classic hard switching applications, in which the low forward resistances of the GaN components are used, users focus on the high switching frequencies achievable with GaN as well as resonant or quasi-resonant circuits.

Exhibitors

List of exhibitors
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