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Exhibition

The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates. It gives all attendees and exhibiting companies enough space for networking.

budatec

budatec

budatec

budatec GmbH is a plant manufacturer for the semiconductor and solar industry based in Berlin. The main business areas are thermal systems and products related to electronics manufacturing.

The focus here is on vacuum soldering systems, ranging from small batch plants to fully automated production systems. We have had experience in this field for over 20 years. Our vacuum soldering systems are developed, manufactured and distributed worldwide in Berlin. In this segment, budatec GmbH is one of the technological market leaders, especially in the use of hydrogen and plasma gases.

The company was founded in 2009 and now employs a team of experienced engineers and software developers.

Our customers include well-known technology companies, research and development departments of renowned institutes as well as universities and technical colleges.


ECPE

ECPE - The Industrial and Research Network for Power Electronics in Europe

ECPE

The main objective of ECPE European Center for Power Electronics e.V. is pre-competitive research, education and advanced training as well as public relations for power electronics in Europe. For an efficient realisation two legal bodies have been established, the registered association ECPE e.V. and the limited company ECPE GmbH.

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Fraunhofer IISB (2)

Fraunhofer IISB

Fraunhofer IISB (2)

The research field is packaging of power electronics. The drivers are performance, volume and weight per cost depending on the application. The goal is reached by investigations of different concepts of the electrical, mechanical and thermal design such as single and double sided die attach, single and double sided cooling, materials with minimized or matched coefficient of thermal expansion (CTE). By use of intelligent setups and application relevant measures of the electrical and thermal interconnections the bill of material is minimized.

Work is done on joining technologies as well. There is a long experience in silver sintering as an alternative to the state of the art. Meanwhile a process is established to manufacture multichip power modules with high yield. Especially a selective sintering process brings big pace to electronic packaging, especially on printed circuit board. The chips sizes meet the power electronics requirements. While the sintering improvements are ongoing the soldering technology is still covered for new high performance or high temperature materials.

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Fraunhofer Institute for Reliability and Microintegration IZM

As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research. Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems.
The four Fraunhofer IZM departments promote internationally cutting-edge technology development. The departments jointly work on application areas and key development topics, ensuring the research is advanced across technologies. In key development topics, the Fraunhofer IZM researchers monitor and develop highly promising research questions, paving the way for future projects with industry.
Here, Fraunhofer IZM benefits from its close cooperation with the Technischen Universität Berlin and other scientific institutes. Fraunhofer IZM has cooperated on highly productive preliminary research with the TU Berlin since its establishment, and the close relationship between the institute and university is best illustrated by the current practice of appointing a joint IZM institute head and TU university professorship.
Therefore the Fraunhofer IZM has a great expertise in research into power electronic systems. At the CIPS 2018 we are looking forward to present our concepts for solutions of embedded power electronics as well as examples for manufacturing and analyzing ultra-sonic bond connections. A model of the mechanical stress within a bond wire will depict how simulation can help increasing the reliability of power electronic modules. www.izm.fraunhofer.de

imperix.ch

imperix

imperix.ch

Imperix is a Swiss company developing high-end control equipment and prototyping hardware for power electronics, drives, smart grids and related topics. Its products are designed to enable cutting-edge innovation in corporate and academic environments. They are especially valued for their ability to accelerate the implementation of laboratory-scale power converters and facilitate the derivation of high quality experimental results.

The company also offers various levels of integration services, intended to assist its customers in their prototyping activities. As such, its offering ranges from the delivery of plug-and-play hardware and software, to that of fully customized systems involving specialized control software algorithms. For more information, visit https://www.imperix.ch.


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ISP System

ISP System is a leading manufacturer of fully automated high precision mechatronics systems and manufacturing equipments.

The offering includes laser selective soldering machine, adhesive die bonder, and together with our partners we have developed an innovative sintering process allowing high thermal conductivity assembly for power packaging.

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Keysight

At Keysight, we help move technology forward. By offering solutions and services for electronic design and test, we help visionaries and innovators achieve the breakthroughs that advance technology.

And while we offer a broad portfolio of measurement hardware, we are also a respected name in software: our electronic design automation (EDA) software for communications product design helps to accelerate the development of better products with integrative design and simulation tools.
PathWave Advanced Design System (ADS) is our design software for RF, microwave, high speed digital, and power electronics applications. In a powerful and easy-to-use interface, ADS offers a variety of simulation technologies, such as X-parameters and 3D EM simulators, used by companies in markets including energy industries and switched-mode power supply designs.
ADS provides full, standards-based design and verification in an integrated platform. This includes:
-    Modeling of Power Devices  
-    Analyzing parasitic impedance of PCB traces and vias
-    Model EMI/EMC in a virtual chamber

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Rogers-bild

Rogers-article

Rogers-bild

Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable advanced connectivity and advanced mobility applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.


Plexim

PLECS, the Simulation Platform for Power Electronic Systems

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Siemens (1)

Siemens

Siemens Digital Industries Software reflects the depth of our broad software offerings across a broad spectrum of industry domain. By blurring the boundaries between industry domains, across both physical and digital worlds, we bring the technologies of tomorrow to our customers today. For firther information: https://www.plm.automation.siemens.com/global/en/#

Siemens (1)

Siemens Digital Industries Software reflects the depth of our broad software offerings across a broad spectrum of industry domain. By blurring the boundaries between industry domains, across both physical and digital worlds, we bring the technologies of tomorrow to our customers today. For firther information: https://www.plm.automation.siemens.com/global/en/#