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The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates. It gives all attendees and exhibiting companies enough space for networking.


ECPE - The Industrial and Research Network for Power Electronics in Europe


The main objective of ECPE European Center for Power Electronics e.V. is pre-competitive research, education and advanced training as well as public relations for power electronics in Europe. For an efficient realisation two legal bodies have been established, the registered association ECPE e.V. and the limited company ECPE GmbH.

Fraunhofer IISB (2)

Fraunhofer IISB

Fraunhofer IISB (2)

The research field is packaging of power electronics. The drivers are performance, volume and weight per cost depending on the application. The goal is reached by investigations of different concepts of the electrical, mechanical and thermal design such as single and double sided die attach, single and double sided cooling, materials with minimized or matched coefficient of thermal expansion (CTE). By use of intelligent setups and application relevant measures of the electrical and thermal interconnections the bill of material is minimized.

Work is done on joining technologies as well. There is a long experience in silver sintering as an alternative to the state of the art. Meanwhile a process is established to manufacture multichip power modules with high yield. Especially a selective sintering process brings big pace to electronic packaging, especially on printed circuit board. The chips sizes meet the power electronics requirements. While the sintering improvements are ongoing the soldering technology is still covered for new high performance or high temperature materials.



At Keysight, we help move technology forward. By offering solutions and services for electronic design and test, we help visionaries and innovators achieve the breakthroughs that advance technology.

And while we offer a broad portfolio of measurement hardware, we are also a respected name in software: our electronic design automation (EDA) software for communications product design helps to accelerate the development of better products with integrative design and simulation tools.
PathWave Advanced Design System (ADS) is our design software for RF, microwave, high speed digital, and power electronics applications. In a powerful and easy-to-use interface, ADS offers a variety of simulation technologies, such as X-parameters and 3D EM simulators, used by companies in markets including energy industries and switched-mode power supply designs.
ADS provides full, standards-based design and verification in an integrated platform. This includes:
-    Modeling of Power Devices  
-    Analyzing parasitic impedance of PCB traces and vias
-    Model EMI/EMC in a virtual chamber



PLECS, the Simulation Platform for Power Electronic Systems


Become an exhibitor!

  • Take advantage one 1:1 discussions, of interaction be manufacturers, producers, and decision makers.
  • Place your company on the first stage, by creating a communication area during the coffee and lunch breaks as well as during the Get Together.
  • select the best place for your booth in the Atrium and directly in the catering area.
  • Benefit from our networking opportunities and media conception of the conference.


Exhibition Package

  • Exhibition booth size: 3 m x 2 m (bigger booth can be also possible)
  • Electricity 230 V, 16 A
  • Tables ( 1,80 m x 0,40 m) and chairs
  • One conference free pass included.
  • Logo on the webpage and conference program
  • WiFi Access

Price: 1600€  (+VAT)

Cancellation Deadline: free of charge (two months before event start). The cancellation has to be in written form.

Sign up for the Exhibition
general information

General information for exhibitors

general information

Additional bookings such as electricity, booth furnitures, booth cleaning, pinboards aso can be ordered separately.

We recommend to contract an insurance for dammages and loss.

Exhibitors have to respect the general rules of the venue during the event days.