CIPS 2026 | Table Top Exhibition
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Hotel Bilderberg Dresden

| Matthias Hamel

The exhibition will take place at the Bilderberg Hotel Dresden, Germany, where conference attendees can explore the latest developments and advancements in integrated power electronic systems. We encourage companies to take advantage of this opportunity to connect with leading experts and to showcase their products and services to a global audience.

Become an exhibitor !

  • Take advantage one 1:1 discussions, of interaction be manufacturers, producers, and decision makers.
  • Place your company or institution on the first stage, by creating a communication area during the coffee and lunch breaks as well as during the Get Together.
  • select the best place for your booth in the Atrium and directly in the catering area.
  • Benefit from our networking opportunities and media conception of the conference.

Exhibition Package

  • Table Top exhibition including one table (1,80 m x 0,40 m) and two chairs (larger spaces are also available upon request)
  • 230 V power supply
  • One conference free pass included.
  • Logo on the website, App and conference program
  • WiFi Access

Table Top Package: 2300€  (+VAT)

Cancellation Deadline: free of charge (two months before event start). The cancellation has to be in written form.

Sign up for Table Top Booth

CIPS 2026 Floorplan

CIPS 2026 Exhibition Plan
© VDE

List of exhibitors (A-Z)

budatec GmbH

The budatec GmbH is since 2009 a plant manufacturer for the semiconductor and solar industry and based in Berlin.

The budatec GmbH is since 2009 a plant manufacturer for the semiconductor and solar industry and based in Berlin.

The main business areas are thermal systems as well as products and solutions for electronic manufacturing. The main focus is on vacuum soldering systems and systems for sintering semiconductor chips. The product range extends from small batch systems to fully automated production systems. Budatec systems are used worldwide for the production of electronic and power electronic components, by automotive industry suppliers, in the manufacturing of lasers and in medical technology. In numerous research facilities, budatec systems are the basis for the implementation of new technologies. 

www.budatec.de

DOWA HD Europe GmbH

The DOWA Group was founded in 1884 as a mining and smelting company.

The DOWA Group was founded in 1884 as a mining and smelting company.

Since its establishment, the DOWA Group has evolved its operations in a number of directions in step with the changing times, to the extent of forging a unique recycling-oriented business structure.

www.hd.dowa.co.jp

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB

The Fraunhofer Institute for Integrated Systems and Device Technology IISB is one of Europe’s leading research institutions for wide-bandgap semiconductors and power electronics, covering the complete value chain.

The Fraunhofer Institute for Integrated Systems and Device Technology IISB is one of Europe’s leading research institutions for wide-bandgap semiconductors and power electronics, covering the complete value chain.

The spectrum ranges from basic materials, semiconductor devices and process technologies, power electronic modules and components to complete power electronic and energy systems. Main target applications of the IISB are semiconductor manufacturing, electromobility, aerospace as well as sustainable energy supply. With its solutions, the institute has been setting benchmarks in energy efficiency and performance, even for extreme operating conditions. The integration of intelligent data-based functionalities also continuously opens up new application scenarios. Fraunhofer IISB supports its customers and partners worldwide in transferring scientific results into commercial products. Its activities are organized in two business areas: Semiconductor Technology and Power Electronic Systems. A total of around 400 employees works at the headquarters in Erlangen, Bavaria, at the Fraunhofer Technology Center High Performance Materials THM in Freiberg, Saxony and at the E|Road Center in Hallstadt.

www.iisb.fraunhofer.de

Fraunhofer IKTS

For more than 30 years, Fraunhofer IKTS has been demonstrating the potential of ceramic materials in a steadily growing range of applications.

For more than 30 years, Fraunhofer IKTS has been demonstrating the potential of ceramic materials in a steadily growing range of applications.

Our development work is derived from the needs of the nine market-oriented business divisions – supplemented by strategic preliminary research at the highest scientific level.

It is our goal to develop complete system solutions and services, but also to solve specific challenges within the processes of our partners from industry and science. Our expertise in characterizing materials, components and systems along their life cycle provides us with a unique data pool to carry out new developments more efficiently and faster.

With state-of-the-art equipment on more than 40,000 m² of floor space, competent staff and result-oriented research management, we offer a contact point for companies and research partners to tap the unique properties of ceramic materials for new and improved applications.

www.ikts.fraunhofer.de

Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS

Pioneering Material Diagnostics for Power Electronics - Fraunhofer IMWS develops cutting-edge methods for analyzing and optimizing electronic materials and components.

Pioneering Material Diagnostics for Power Electronics - Fraunhofer IMWS develops cutting-edge methods for analyzing and optimizing electronic materials and components.

The institute focuses on understanding the intricate relationships between production processes, operating conditions, and the resulting microstructural, material, and functional properties. 

Using advanced techniques such as non-destructive analysis, high-resolution electron microscopy, mechanical material characterization, and numerical simulation, Fraunhofer IMWS leads the way in failure diagnostics, process qualification, and degradation analysis. These efforts aim to enhance the reliability, quality, and efficiency of electronic systems throughout their entire lifecycle. 

In addition to power electronics, Fraunhofer IMWS supports industries such as automotive electronics and communication technologies, delivering fast, data-driven solutions. The institute’s state-of-the-art infrastructure and decades of expertise in material and failure diagnostics are complemented by micromechanical testing and simulation capabilities, enabling precise solutions to even the most complex challenges. 

What sets Fraunhofer IMWS apart is its customer-centric approach, flexibility, and speed in addressing industry needs. By accelerating innovation and reducing costs, the institute helps its partners improve product reliability and bring solutions to market faster. 

Visit our booth to learn how Fraunhofer IMWS can help you tackle the reliability challenges of power electronics and beyond!

www.imws.fraunhofer.de

Heraeus Electronics GmbH & Co. KG

Heraeus Electronics is one of the leading manufacturers of materials for packaging technology in the electronics industry.

Heraeus Electronics is one of the leading manufacturers of materials for packaging technology in the electronics industry.

The operating company develops sophisticated material solutions for the automotive industry, power electronics, and advanced packaging in development centers and production facilities in Asia, the USA, and Europe. As a solution provider, Heraeus Electronics offers its customers a broad product portfolio - from materials and material systems to components and services. 

www.heraeus-electronics.com

University of Bremen - Institute for Electrical Drives, Power Electronics and Devices (IALB)

The IALB of the University of Bremen does research in the fields of electrical drives, power electronics and devices.

The IALB of the University of Bremen does research in the fields of electrical drives, power electronics and devices.

This includes the design, modelling and simulation as well as testing of novel components, frequency converters and drives as a whole. We will present the High Power Electronics-Laboratory (HiPE-LAB), which enables the testing of individual components or entire systems under realistic climatic and electrical conditions. Temperatures between -40 °C and +120 °C in combination with relative humidity from 10% to 95% and up to 10 MVA power-in-the-loop can be reached. By individual test profiles nearly all climatic zones on earth can be simulated. Additionally, we will show the latest version of the "M-Shunt", a low-inductance current sensor that is particularly well suited for circuits containing fast-switching wide band-gap semiconductors.

www.uni-bremen.de

ZESTRON Europe

For over 30 years, ZESTRON has been supporting electronics manufacturers around the globe in increasing product reliability, making production processes more robust, and maximizing yield – for both power electronics and assembled PCBs. 

For over 30 years, ZESTRON has been supporting electronics manufacturers around the globe in increasing product reliability, making production processes more robust, and maximizing yield – for both power electronics and assembled PCBs. 

Our expertise is built on in-depth know-how in analytics, AVT of functional surfaces and innovative surface modification, combined with long-standing partnerships with more than 3,000 companies worldwide. As an internationally leading provider, we not only offer thorough root cause analyses for validation and field failures, but also implement effective measures to sustainably prevent future damage – with or without cleaning. 

www.zestron.com

List of exhibitors (by booth number)

Booth No.

Company name

Booth No. 1

Institute for Electrical Drives, Power Electronics and Devices (IALB)

Booth No. 2

Booth No. 3

Booth No. 4

Fraunhofer IKTS

Booth No. 5

Booth No. 6

Booth No. 7

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB

Booth No. 8

budatec GmbH

Booth No. 9

Booth No. 10

DOWA HD Europe GmbH

Booth No. 11

ZESTRON Europe

Booth No. 12

Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS

Booth No. 13

Telemeter Electronic GmbH

Booth No. 14

Heraeus Electronics GmbH & Co. KG


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General information for exhibitors

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Additional bookings such as electricity, booth furnitures, booth cleaning, pinboards aso can be ordered separately.

We recommend to contract an insurance for dammages and loss.

Exhibitors have to respect the general rules of the venue during the event days.