CIPS 2020 Logo
Sarah Rugen + (center module) Semikron
2021-02-11

Information for Authors

Below you can find important information for the preparation of your abstract and paper submission.

Extended Abstract submission deadline: September 15, 2021. 

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Important Dates

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Deadline Abstract Submission15.09.2021
Notification of preliminary Acceptance02.11.2021
Full Paper Submission Deadline15.12.2021
Notification of Acceptance Full Paper13.01.2022
Final Paper Submission Deadline (if modifications required)22.01.2022
Notification of Acceptance Final Paper for publication12.02.2022
Deadline for authors registration19.02.2022
Conference start15.03.2022

General Information

Please follow the typing instructions described here

Please follow the typing instructions described here

  • After acceptance, the authors are asked to submit the full paper with a length of up to 6 pages for publication.
  • The proceedings will be published by VDE Verlag; presented  papers will in addition be available on IEEE Xplore®.
  • Papers previously presented and published in the Conference Proceedings of CIPS can be considered for publication in IEEE Transactions on Power Electronics when improved with additions beyond the conference paper, which needs to be referenced, cf. Guidelines for Manuscript Submission to IEEE Transactions on Power Electronics.
  • By submitting your full paper we assume that you have accepted the copyright­statement:  www.vde.com/typing­-instructions.
  • After the conference, the presentations will be made available exclusively for all participants on that homepage.
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Tips: Preparation of your abstract

Please use the attached word template for preparation of your abstract.

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Please use the attached word template for preparation of your abstract.

The abstract should have a two DIN A4 pages with title, summary, motivation, structure and core results as well as associated images and references (literature, sources, references). 

Describe in your abstract most relevant content and results of your work. Significant pictures and charts can point these out.

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Tips: How to prepare your paper for the proceedings

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The short abstracts and the paper titles (German/English) will be available in Online Libraries. After the conference, this will enable interested people to find easily these contributions.

For titles  use the given guidelines.

A picture tells more than 1000 words. Use the pictures so that these can translate the wished meaning at a glance...

Don't forget to announce the source.

References have to be included at the end of the paper. Please check the typing guidelines. If you wish to refer to other sources from this same event, please contact in advance the event organisers.

Templates for Authors
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TIP: How to prepare your poster

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Wir empfehlen die Erstellung eines Posters in der Größe DIN A0 lang Format. You are free to design the layout of your poster.

If you wish to use the banner oder logo of the event, you can find this under "downloads".

Pinnboards (1,40 m x 1,20 m breit). Pins will be provided on site. The poster titles will be mentioned on boards.

Please put your poster on the your poster board on the the first day of the event (starting from 9:00 h) and remove it at the ene dof the event. Please note that posters that haven't been removed from authors will be disposed.

Please be at your poster board during the poster session in order to answer the questions of the attendees.

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Conference topics

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Applications are wide spread over areas such as

  • transportation: automotive, railway, aircraft
  • power electronics in the grid, in particular for renewable energy: wind, solar ...
  • drives and power supplies

 

1. Components to be integrated

  • advanced silicon devices and monolithic integration
  • wide bandgap devices and monolithic integration
  • gate drivers
  • passive components
  • sensors and actuators

2. General aspects of packaging

  • system and component packaging
  • assembly concepts, embedded power, 3D integration
  • new materials and interconnects
  • additive manufacturing
  • high voltage insulation
  • design for high temperature applications
  • cooling concepts
  • interface materials
  • multi­domain CAD (electrical, thermal, mechanical, chemical) as design tool

3. Power packages and modules

  • bare chip packaging
  • discrete semiconductor packages
  • hermetic semiconductor packages
  • power semiconductor modules
  • heterogeneous integration, power system­-in­-package

4. System and application aspects

  • mechatronic systems and their applications
  • integration of power electronics into electric machines
  • challenges of fast switching on circuit/system level - winding insulation, bearing currents, earth leakage, touch current, ...
  • integration with sensors and actuators
  • overall system optimisation

5. Reliability and Availability

  • reliability requirements, mission profiles
  • robustness validation, physics of failure, failure analysis,
  • modelling and simulation of lifetime
  • intelligent reliability testing
  • prognostics and health management
  • fault tolerant designs and applications

6. Clean switching, electromagnetic compatibility (EMC)

  • parasitics and interferences; design for low inductance, coupling capacity
  • electrodynamically optimised design
  • optimised control through driving scheme filters

 

Please select the most appropriate topic for your contribution. The other topics are possible examples. Please submit your contribution even if you can not find the appropriate topic for your contribution. All interesting contributions are welcome!

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Awards

The CIPS Best Poster Award is granted at each CIPS for an outstanding poster presentation. The technical content and general structure of both the paper and the poster are evaluated.

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The CIPS Best Poster Award is granted at each CIPS for an outstanding poster presentation. The technical content and general structure of both the paper and the poster are evaluated.

ECPE also presents the ECPE Young Engineer Award. In order to be considered for this Award, the candidates have to be under 35 at the first conference day.

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Exhibition

The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates.

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The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates.

The exhibition is the communicative core of the conference. Manufacturers and service provides present future and praxis oriented applications and products.

Exibition
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Downloads

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Exhibitors