| Sarah Rugen + (center module) Semikron
2016-01-01 5372 0

Information for Authors

Notification of acceptance for authors: extended to October 24, 2019

Below you can find important information for the preparation of your abstract and paper submission.

Call for Papers

Submit your abstract to CIPS 2020 Int'l Conference on Integrated Power Electronics Systems

Experts from industry and research institutes wishing to present results of their recent research are cordially invited to submit a paper. Accepted papers will be presented in either oral or poster sessions. Please submit a pdf formatted abstract in English with a length of two pages including figures, tables & references showing summary, motivation, approach and results. The paper should be headed by title, authors‘ names and affiliations. Please register your paper using the EDAS online registration. If you have already a personal account, please login with your username and password. Otherwise first create a new account, and then register your paper.

At least one full registration is required per paper. Inclusion of accepted papers in the conference proceedings CD-ROM is conditional upon receiving payment for at least one full registration per paper latest by January 31, 2020.

Call for Paper

CfP Download

CIPS Call for Paper Download

Publishing date: 2019-04-09
PDF: 518 KB


There will be awards for the CIPS Best Poster and the ECPE Young Engineer.

In order to be considered for the ECPE Young Engineer Award, the candicates have to be under 35 at the first conference day.

Important Dates

Deadline Abstract Submission (extended)15.09.2019
Notification of Acceptance24.10.2019
Full Paper Submission Deadline02.12.2019
Notification of Acceptance Full Paper27.01.2020
Final Paper Submission Deadline07.02.2020
Notification of Acceptance Final Paper for publication14.02.2020
Deadline for authors registration31.01.2020
Deadline for short biography upload10.03.2020
Conference start24.03.2020
Deadline upload presentation / poster as pdf-file for participants03.04.2020

Conference Topics

1. Components to be integrated

  • advanced silicon devices and monolithic integration
  • wide bandgap devices and monolithic integration
  • gate drivers
  • passive components
  • sensors and actuators

2. General aspects of packaging

  • system and component packaging
  • assembly concepts, embedded power, 3D integration
  • new materials and interconnects
  • high voltage insulation
  • design for high temperature applications
  • cooling concepts
  • interface materials
  • multi-domain CAD (electrical, thermal, mechanical)
  • as design tool

3. Power packages and modules

  • bare chip packaging
  • discrete semiconductor packages
  • hermetic semiconductor packages
  • power semiconductor modules
  • heterogeneous integration, power system-in-package

4. Mechatronic systems and their applications

  • integration with sensors and actuators
  • integration of power electronics into electric machines
  • overall system optimisation

5. Reliability

  • reliability requirements, mission profiles
  • physics of failure, robustness validation
  • prognostics and health management
  • modeling and simulation of lifetime
  • intelligent reliability testing
  • failure analysis

6. Clean switching, electromagnetic compatibility (EMC)

  • parasitics and interferences, low inductance design
  • electrodynamically optimised design
  • optimised control through driving scheme
  • filters


Templates for Authors


Publishing date: 2019-02-01
PDF: 29 KB

Call for Papers - CIPS 2020

Publishing date: 2019-01-31
Valid to: 2020-03-29
PDF: 670 KB
Fallback Word

CIPS_Word_template_A4_eng DOC

Publishing date: 2019-02-15
WORD: 1.7 MB
Fallback Word

CIPS_Word_template_A4_eng DOCX

Publishing date: 2019-02-15
WORD-Template: 3.6 MB

CIPS_TeX_template TEX

Publishing date: 2019-02-15
???fileExtension.application/x-tex???: 12 KB

CIPS_TeX_template PDF

Publishing date: 2019-02-15
PDF: 36 KB

Direct Link:


Picture: Sarah Rugen + (center module) Semikron