CIPS - International Conference on Integrated Power Electronics Systems

In the next decades, power electronic system develop ment will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will comprise advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS is consequently focused on the following main aspects:

assembly and interconnect technology for power electronic devices and converters
integration of hybrid systems and mechatronic systems with high power density
systems‘ and components‘ operational behaviour, reliability and availability

Basic technologies for integrated power electronic systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.

In 2024 the successful story of CIPS will continue as the conference‘s focus is today more important than ever – increasing functionality, energy efficiency and system reliability while decreasing cost.

Call for Papers

We invite all engineers and scientists coming from industry and academia engaged in power electronics related

system development
component development
reliability engineering
basic and applied research

to share their research and technical achievements joining CIPS 2024.

Together with the TPC Members, we invite you to present your latest research in submitting a paper for oral or poster presentation.

We also offer you the possiblity to book an exhibition space and present your products to the community of CIPS. The exhibition will take place in the foyer of the event hotel.

We are looking forward to welcoming you 2024 in Düsseldorf!

Uploading an abstract

A two stage review process will be applied:

The Technical Program Committee will review the abstracts and decide upon the preliminary acceptance.
Each full paper will be reviewed by peer reviewers.

Please submit a pdf formatted abstract in English with a length of two pages including figures, tables and references showing summary, motivation, approach and results. The paper should be headed by title, authors‘ names and affiliations.

Please register your paper using the EDAS online registration at www.cips.eu as explained below.

Upload no later than August 31, 2023.

To use EDAS, you will need a personal account. When using it for the first time, click on "create new account" and create a user account. If you have forgotten your login information, click on "reset your password" and enter your email address.

After successful login:

enter the paper title
select the preferred presentation type "category": Oral or Poster
select the most applicable topic
add additional authors if necessary: in the line "Authors" under "Change Add" click on the plus symbol and select and add person via search
upload the abstract by clicking on the upload icon next to "Abstract".

After uploading you will receive a confirmation by e-mail.

Important Dates

what	when
Deadline Abstract Submission	31.08.2023
Notification of preliminary Acceptance	16.10.2023
Full Paper Submission Deadline	30.11.2023
Notification of Acceptance Full Paper	12.01.2024
Final Paper Submission Deadline (if modifications required)	22.01.2024
Notification of Acceptance Final Paper for publication	15.02.2024
Deadline for authors registration	19.02.2024
Conference start	12.03.2024

Tips: Preparation of your abstract

Please use the attached word template for preparation of your abstract.

The abstract should have a two DIN A4 pages with title, summary, motivation, structure and core results as well as associated images and references (literature, sources, references).

Describe in your abstract most relevant content and results of your work. Significant pictures and charts can point these out.

Tips: How to prepare your paper for the proceedings

The short abstracts and the paper titles (German/English) will be available in Online Libraries. After the conference, this will enable interested people to find easily these contributions.

For titles use the given guidelines.

A picture tells more than 1000 words. Use the pictures so that these can translate the wished meaning at a glance...

Don't forget to announce the source.

References have to be included at the end of the paper. Please check the typing guidelines. If you wish to refer to other sources from this same event, please contact in advance the event organisers.

TIP: Creating your presentation

If you would like to insert the title graphic of the event or the logos of the organizers, you will find these under Downloads.

Our recommendation for the size of the presentation: A rule of thumb says: "1 slide per minute of presentation".

Convert videos into Windows Media video files (.wmv) using Microsoft Movie Maker. You integrate these into your presentation. Sound is not possible.

On the day of the event, at the latest during the break before your presentation, please bring your presentation as a ppt or pdf file on a USB stick and hand in your presentation to the technical department upon arrival at the registration counter or directly in the lecture room.

A Windows laptop with PowerPoint (ppt, pptx, pps, ppsx), Acrobat Reader (pdf) and a projector will be available for the presentation. If you are using special fonts and logos, please bring your own laptop due to possible incompatibilities.

During the break before your presentation, please test the start of the presentation and the correct display of the pages. Please familiarize yourself with the equipment.

TIP: How to prepare your poster

Wir empfehlen die Erstellung eines Posters in der Größe DIN A0 lang Format. You are free to design the layout of your poster.

If you wish to use the banner oder logo of the event, you can find this under "downloads".

Pinnboards (1,40 m x 1,20 m breit). Pins will be provided on site. The poster titles will be mentioned on boards.

Please put your poster on the your poster board on the the first day of the event (starting from 9:00 h) and remove it at the ene dof the event. Please note that posters that haven't been removed from authors will be disposed.

Please be at your poster board during the poster session in order to answer the questions of the attendees.

Conference topics

Applications are wide spread over areas such as

transportation: automotive, railway, aircraft
power electronics in the grid, in particular for renewable energy: wind, solar ...
drives and power supplies

1. Components to be integrated

advanced silicon devices and monolithic integration
wide bandgap devices and monolithic integration
gate drivers
passive components
sensors and actuators

2. General aspects of packaging

system and component packaging
assembly concepts, embedded power, 3D integration
new materials incl. interface materials and interconnects
additive manufacturing
high voltage insulation
design for high temperature applications
cooling concepts
multidomain CAD and design tools

3. Power packages and modules

bare chip packaging
discrete semiconductor packages
hermetic semiconductor packages
power semiconductor modules
heterogeneous integration, power systeminpackage

4. System and application aspects

mechatronic systems and their applications
integration of power electronics into electric machines
challenges of fast switching on circuit/system level winding insulation, bearin currents, earth leakage, touch current, ...
integration with sensors and actuators
overall system optimisation

5. Reliability and availability

reliability requirements, mission profiles
robustness validation, physics of failure, failure analysis
modelling and simulation of lifetime
intelligent reliability testing
prognostics and health management
fault tolerant designs and applications

6. Clean switching, electromagnetic compatibility (EMC)

parasitics optimization: electromagnetically optimized design
oscillation free design
symmetric paralleling of power semiconductors
design of drivers for improved switching waveforms
EMC interferences reductions: optimized control, active filter and passive filter design
EMI filter integrations: material, component design, implementation
integrated sensors and high bandwidth measurement

Please select the most appropriate topic for your contribution. The other topics are possible examples. Please submit your contribution even if you can not find the appropriate topic for your contribution. All interesting contributions are welcome!

Awards

The CIPS Best Poster Award is granted at each CIPS for an outstanding poster presentation. The technical content and general structure of both the paper and the poster are evaluated.

ECPE also presents the ECPE Young Engineer Award. In order to be considered for this Award, the candidates have to be under 35 at the first conference day.

Exhibition

The CIPS will be accompanied by an exhibition which is well appreciated from the conference delegates.

The exhibition is the communicative core of the conference. Manufacturers and service provides present future and praxis oriented applications and products.