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Sarah Rugen + (center module) Semikron
2024-03-15 review of event

CIPS 2024 Düsseldorf: A Dynamic Fusion of Keynotes, Invited Speakers, and Exhibitions in Power Electronics System Integration

CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems, organised by VDE and ECPE 

The CIPS 2024 event in Düsseldorf not only featured enlightening keynote addresses and insightful presentations from Invited Speakers but also housed a vibrant exhibition, creating a holistic experience for attendees. The exhibition served as a hub for showcasing new products, services, and fostering specialized discussions.

Prof. Rik W. De Doncker's keynote on "Integrated Packaging of Wide Bandgap Power Devices for Ultra-high Power Density DC Converters" set the tone for the event, providing a visionary outlook on pushing the boundaries of power density. Francesco Iannuzzo's keynote, "Large-Scale Adoption of Silicon Carbide in the Automotive Sector: What is Missing?" engaged the audience in discussions about the challenges and opportunities in adopting silicon carbide in automotive applications.

Beyond the keynote sessions, the 10 Invited Speakers added depth and diversity to the discourse, covering a spectrum of topics such as advanced materials, emerging technologies, and innovative design approaches in power electronics system integration. This curated selection of presentations enriched the overall experience, offering attendees a comprehensive understanding of the field's current landscape and future directions.

Complementing the enlightening sessions was the exhibition, where companies showcased their latest products and services in power electronics system integration. The exhibition floor buzzed with activity as professionals engaged in specialized discussions, exchanged ideas, and explored innovative solutions. This interactive space served as a nexus for networking, fostering connections between industry leaders, researchers, and enthusiasts.

The meticulous preparation of the event by the volunteer programme committee ensured a seamless experience for attendees, from the state-of-the-art venue to the well-planned schedule. CIPS 2024 not only celebrated the achievements of system integration in power electronics, but also created a platform for knowledge sharing and collaboration that will shape the future of the industry.

We would like to thank our keynote and invited speakers:

Keynote Speaker

Prof. Rik W. De Doncker
Integrated Packaging of Wide Bandgap Power Devices for Ultra-high Power Density DC Converters

Francesco Iannuzzo
Large-Scale Adoption of Silicon Carbide in the Automotive Sector: What is Missing?

Invited Speaker 

Kevin Hermanns
Design Automation for Power Electronics: a path towards realization

Matthias Hammerl
Reliability of GaN power chip embedding in different stack up

Michael Hornkamp
Automotive Plug&Play Gate-Driver for 1200V Automotive SiC/IGBT Modules

Prof. Dr.-Ing. Dennis Kampen
About the perplexing functionality of soft magnetic components in the field despite all the manufacturing and material tolerances and inaccuracies in the calculations

Koji Makihara
The latest material technology to support power module packaging

Jonas Huber
Paradigm Shift in Power Electronics Towards Circular Economy Compatibility

Christian Zorn
A Concept for Detection of Humidity Driven Degradation of IGBT Modules

Marco Liserre
Unlocking the Opportunities of Bidirectional GaN Devices in Isolated DC/DC Converters and Multilevel Inverters

Dima Novo
D3GaN VM044 transfer molded power module for drive train inverter - Design challenges and construction

Mark-M. Bakran
Prof. Dr.-Ing. Mark-M. Bakran
Is the Motor Insulation System really affected by high Voltage Transients?


There were interesting things to see at the exhibition.



| companies


Proceedings ETG FB 165 CIPS 2022

| VDE Publishing House

ETG-Fb. 165: CIPS 2022, 12th International Conference on Integrated Power Electronics Systems, Proceedings March, 15 – 17, 2022, Berlin/Germany, 2022

CD-ROM ISBN 978-3-8007-5757-2, e-book ISBN 978-3-8007-5758-9, ISSN 0341-3934