Since the first CIPS in 1999, this biennial conference has been focused on the integration of hybrid and mechatronic systems with high power density and systems' or components' operational behavior and reliability, respectively. The number of high quality submissions and 350+ participants, both the highest number ever in this conference series, has emphasised the major interest of the international power electronics community in these topics. Again, CIPS had a good mixture of participants from industry, research institutes and academia and provided an excellent forum for scientific exchange and networking. The peer-reviewed contributions are available in the proceedings and will be accessible via digital libraries.
One trend became apparent at CIPS 2018: New power semiconductor devices based on the wide band-gap materials silicon carbide (SiC) and gallium nitride (GaN) fertilise the development of system integration as well as non-standard applications. Those fast switching devices require packaging solutions and circuit components which contribute only small parasitic elements, e.g. stray inductances, and avoid issues due to electromagnetic interference (EMI). Furthermore, they impose the necessity to implement additional measures, processes and tests to ensure a suitable reliability. This is a precondition for their use in conventional but also new applications of power electronic systems, which require e.g. high power density, reliable operation under harsh conditions such as high temperature, and of course lowest cost. Figure "Little box 2" shows an example of the impressive research results presented at CIPS 2018: The power supply by ETH Zürich offers a remarkably high power density of 14.8 kW/l. The excellent mixture of CIPS contributions from industry as well as from universities and research institutes proves that the hot topic of integrated power electronic systems is dealt with in science, industrial research and product development. While the technology is mature enough for industrial use, substantial further research is required to cope with future challenges.