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2018-03-26 728 0

Sign up for the Exhibition!

The CIPS Conference will be accompanied by an exhibition which is well appreciated from the conference delegates. It gives all attendees and exhibiting companies enough space for networking.

  • Take advantage one 1:1 discussions, of interaction be manufacturers, producers, and decision makers.
  • Place your company on the first stage, by creating a communication area during the coffee and lunch breaks as well as during the Get Together.
  • select the best place for your booth in the Atrium and directly in the catering area.
  • Benefit from our networking opportunities and media conception of the conference.
Sign up for Table Top

Exhibition Package

  • Exhibition booth size: 3 m x 2 m (bigger booth can be also posisible)
  • Electricity 230 V, 16 A
  • Tables ( 1,80 m x 0,40 m) and chairs
  • One conference free pass included.
  • Logo on the webpage and conference program
  • WiFi Access

Price: 1600€  (+VAT)

Cancellation Deadline: free of charge (two months before event start). The cancellation has to be in written form.

Table Top Exhibition Plan

general information

General information for exhibitors

general information

Additional bookings such as electricity, booth furnitures, booth cleaning, pinboards aso can be ordered separately.

We recommend to contract an insurance for dammages and loss.

Exhibitors have to respect the general rules of the venue during the event days.

Icon Kontakt


Icon Kontakt

For all questions regarding the conference participation, the preparation of lectures, posters, conference proceedings, the organization of the exhibition, etc., please contact the VDE Conference Service.


Headquartered in Beaverton, Oregon, Tektronix delivers innovative, precise and easy-to-operate test, measurement and monitoring solutions that solve problems, unlock insights and drive discovery. Tektronix has been at the forefront of the digital age for over 70 years. Join us on the journey of innovation at TEK.COM.



PLECS, the Simulation Platform for Power Electronic Systems



The Mechanical Analysis Division of Mentor, a Siemens business, provides 1D thermos-fluid & 3D CAD-embedded general-purpose CFD software, electronics cooling software, electromagnetic and motor design software, electronics thermal characterization hardware, and active power cycling equipment for failure-in-progress diagnosis for power electronics components including diodes, IGBTs, and MOSFETs.

Mentor’s solutions help customers in a wide range of industries worldwide to eliminate mistakes, reduce costs and accelerate their engineering design and development processes. Engineers use our solutions to optimize designs involving heat transfer, fluid flow and electromagnetic effects before physical prototypes are built, as well as thermally characterize and test electronic components and systems.



At Keysight, we help move technology forward. By offering solutions and services for electronic design and test, we help visionaries and innovators achieve the breakthroughs that advance technology.

And while we offer a broad portfolio of measurement hardware, we are also a respected name in software: our electronic design automation (EDA) software for communications product design helps to accelerate the development of better products with integrative design and simulation tools.
PathWave Advanced Design System (ADS) is our design software for RF, microwave, high speed digital, and power electronics applications. In a powerful and easy-to-use interface, ADS offers a variety of simulation technologies, such as X-parameters and 3D EM simulators, used by companies in markets including energy industries and switched-mode power supply designs.
ADS provides full, standards-based design and verification in an integrated platform. This includes:
-    Modeling of Power Devices  
-    Analyzing parasitic impedance of PCB traces and vias
-    Model EMI/EMC in a virtual chamber


ISP System

ISP System is a leading manufacturer of fully automated high precision mechatronics systems and manufacturing equipments.

The offering includes laser selective soldering machine, adhesive die bonder, and together with our partners we have developed an innovative sintering process allowing high thermal conductivity assembly for power packaging.


ISE Magnetics

ISE MAGNETICS™ is a manufac­turer and design house of inductive components; having production and (sales) offices in western and east­ern Europe, we also subcontract production in Asia which we strictly prescribe, controll and inspect.

The ISE staff consists of 50 people. ISE’s headquarters is located in the renowned Dutch High Tech area Brainport in the Netherlands.

ISE Magnetics presents on the CIPS 2018 the latest devel­opment in planar transformers and inductors for switch mode power supply applications.


Heraeus Deutschland GmbH & Co. KG

Heraeus Electronics – a Global Business Unit of the Heraeus Group – is one of the leading manufacturers of materials for the assembly and packaging of devices in the electronics industry. The company deals with sophisticated materials solutions for consumer electronics and computing, automotive, LED, industrial – power electronics as well as communications.


Core competences include bonding wires, assembly materials, thick film pastes as well as roll clad strips and substrates.


Fraunhofer Institute for Reliability and Microintegration IZM

As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research. Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems.
The four Fraunhofer IZM departments promote internationally cutting-edge technology development. The departments jointly work on application areas and key development topics, ensuring the research is advanced across technologies. In key development topics, the Fraunhofer IZM researchers monitor and develop highly promising research questions, paving the way for future projects with industry.
Here, Fraunhofer IZM benefits from its close cooperation with the Technischen Universität Berlin and other scientific institutes. Fraunhofer IZM has cooperated on highly productive preliminary research with the TU Berlin since its establishment, and the close relationship between the institute and university is best illustrated by the current practice of appointing a joint IZM institute head and TU university professorship.
Therefore the Fraunhofer IZM has a great expertise in research into power electronic systems. At the CIPS 2018 we are looking forward to present our concepts for solutions of embedded power electronics as well as examples for manufacturing and analyzing ultra-sonic bond connections. A model of the mechanical stress within a bond wire will depict how simulation can help increasing the reliability of power electronic modules.

Fraunhofer IISB (2)

Fraunhofer IISB

Fraunhofer IISB (2)

The research field is packaging of power electronics. The drivers are performance, volume and weight per cost depending on the application. The goal is reached by investigations of different concepts of the electrical, mechanical and thermal design such as single and double sided die attach, single and double sided cooling, materials with minimized or matched coefficient of thermal expansion (CTE). By use of intelligent setups and application relevant measures of the electrical and thermal interconnections the bill of material is minimized.

Work is done on joining technologies as well. There is a long experience in silver sintering as an alternative to the state of the art. Meanwhile a process is established to manufacture multichip power modules with high yield. Especially a selective sintering process brings big pace to electronic packaging, especially on printed circuit board. The chips sizes meet the power electronics requirements. While the sintering improvements are ongoing the soldering technology is still covered for new high performance or high temperature materials.


DOWA HD Europe GmbH

The DOWA group was founded in 1884 in Akita/Japan. By harnessing in technologies and operational experiences in mining and smelting, we today operates unique businesses that range extensively from production of metals to materials for electronic devices.
For power electronics applications we, DOWA, have developed and manufacture high-performance metal-ceramics substrates as well as  baseplate materials for over 20 years.
For inventors of industrial machinery, for highspeed railway, for solar and wind power, we are producing AMB substrates with superior heat dissipation and high voltage endurance.
For automotive applications which require superb heat cycles endurance under severer conditions, ALMIC (DAB substrates) and Integrated Substrates, developed our own MCB process, have been selected.
In additions, we are producing Cu baseplate materials which are an effective combination of high thermal conductivity, high softening resistance and high tensile strength for the usage as heatsink bases, head spreaders, high current terminals, bus bars, lead frames.

Bs&T (1)

Bs&T Frankfurt am Main GmbH

Bs&T (1)

Product / Know-How:

Bs&T is specialist for measuring technique of soft magnetic materials under high excitation (sinusoidal and pulse), for non linear behavior of hysteresis loop for material development, inductive component design. BsT-x BH Analyzer concept is compliant to IEC62044-3, BsT-Pro is capable of measuring non linear soft magnetic properties under high excitation under biased condition. BsT-pulse based on Thyristor Technology, driving power magnetic components bipolar in saturation, the demagnetization provides essential information as loss. BsT-SQ is designed for AC loss of inductor under repetitive pulse condition.


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Picture: Sarah Rugen + (center module) Semikron