Program and Speaker - pic
2019-04-26 359 0

Program and Speakers

We are pleased to announce our Keynote and Invited Speakers

Keynote Speakers

Dr. Isik C. Kizilyalli - Pictuee

Dr. Isik C. Kizilyalli

Wide-Bandgap Semiconductor Power Electronics: Overcoming Barriers in Materials to Circuits for a more Electrified Future

Dr. Isik C. Kizilyalli - Pictuee

Wide-Bandgap Semiconductor Power Electronics: Overcoming Barriers in Materials to Circuits for a more Electrified Future

Dr. Isik C. Kizilyalli currently serves as a Program Director at the Advanced Research Projects Agency – Energy (ARPA-E), Department of Energy. Kizilyalli’s focus at ARPA-E includes high efficiency power conversion, power electronics, wide bandgap semiconductors, grid reliability, reliable semiconductors for extreme environments, instrumentation for intrinsically safe nuclear energy, and sub-surface technologies. Prior to joining ARPA-E, Kizilyalli served as founder, Chief Executive Officer, and Chief Technical Officer of Avogy Inc., a venture backed start-up focused on GaN power electronics, energy efficiency, and power systems. Previously, he was with Bell Laboratories, followed by Nitronex Corporation, and solar PV startup Alta Devices where his team holds the world record for single junction solar cell conversion efficiency. Kizilyalli was elected a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2007 for his contributions to Integrated Circuit Technology. He also received the Bell Laboratories’ Distinguished Member of Technical Staff award and the Best Paper Award at the International Symposium on Power Semiconductors and Integrated Circuits in 2013. Kizilyalli holds his B.S. in Electrical Engineering, M.S. in Metallurgy, and Ph.D. in Electrical Engineering all from the University of Illinois Urbana-Champaign. He has published more than 100 papers and holds 119 U.S. patents.

Robert Pilawa Bild

Robert Pilawa

Capacitor-Based Power Converters for High Power Density and Efficiency - the Theoretical Promises and Practical Challenges

Robert Pilawa Bild

Capacitor-Based Power Converters for High Power Density and Efficiency - the Theoretical Promises and Practical Challenges

Robert Pilawa-Podgurski is currently an Associate Professor in the Electrical Engineering and Computer Sciences Department at the University of California, Berkeley. Previously, he was an Associate Professor in Electrical and Computer Engineering at the University of Illinois Urbana-Champaign. He received his BS, MEng, and PhD degrees from MIT. He performs research in the area of power electronics, with a focus on high power density and high efficiency converter architectures. Dr. Pilawa-Podgurski received the the Google Faculty Research Award in 2013, and the 2014 IEEE PELS Richard M. Bass Outstanding Young Power Electronics Engineer Award. Among his numerous other awards and recognitions, he is most proud of his teaching awards, including the  2017 UIUC ECE Ronald W. Pratt Faculty Outstanding Teaching Award and the 2018 IEEE Education Society Mac E. Van Valkenburg Award given for outstanding contributions to teaching unusually early in ones career. Since 2014, he serves as Associate Editor for IEEE Transactions on Power Electronics, and for IEEE Journal of Emerging and Selected Topics in Power Electronics. He is co-author of nine IEEE prize papers.

Professor Volker Pickert - picture

Prof. Volker Pickert

Present and Future of Fault Tolerant Drives applied to Transport Applications

Professor Volker Pickert - picture

Present and Future of Fault Tolerant Drives applied to Transport Applications

Professor Volker Pickert is the leader of the Electrical Power Group at Newcastle University. He has 25 years of industrial and academic experience in power electronics and electric drives. He is regularly invited as keynote speaker and advises various governments on energy and transport related issues. He has led over 50 funded projects, supervised over 40 PhD students and manages a team of 100 researchers. He is the Editor-in-Chief of the IET Power Electronics journal. In April 2019 he has become the Director of UK’s EPSRC Doctoral Training Centre in Power Electronics for Sustainable Electric Propulsion. This Centre will train over 50 PhD students over the next five years

Invited Speakers

Dr. Fang Luo (1)

Dr. Fang Luo

High Power Density EMI Mitigation in Power Electronics Converters: Active and Integrated Solutions

Dr. Fang Luo (1)

High Power Density EMI Mitigation in Power Electronics Converters: Active and Integrated Solutions

Dr. Fang Luo is Assistant Professor in Electrical Engineering Department at the University of Arkansas. Prior to joining Arkansas, he was a Research Assistant Professor with the Center for High Performance Power Electronics (CHPPE) at The Ohio State University. Dr. Luo got his PhD degree in 2010 from Huazhong University of Science and Technology, Wuhan, China, jointly with Virginia Tech, Blacksburg, Virginia, U.S.A. From 2010 to 2014, Dr. Luo was a postdoctoral researcher at Virginia Tech.

Dr. Luo is a senior member of IEEE. He holds two US patents and has authored/co-authored more than 20 journal papers and more than 50 peer-reviewed conference papers. He is a recipient National Science Foundation CAREER award. His research interests include high power-density converter design, high-density EMI filter design and integration, and power module packaging/integration for wide band-gap devices.

Matthias Kasper - Picture

Dr. Matthias Kasper

Ultra-high power density server supplies employing GaN power semiconductors and PCB-integrated Magnetics

Matthias Kasper - Picture

Ultra-high power density server supplies employing GaN power semiconductors and PCB-integrated Magnetics

Dr. Matthias Kasper received the M.Sc. and Dr.Sc. degree in electrical engineering from the Swiss Federal Institute of Technology (ETH) Zurich, Switzerland, in 2011 and 2016, respectively. During his studies he focused on power electronics, mechatronics and energy systems. In his PhD at the Power Electronic Systems Laboratory at ETH Zurich under the supervision of Prof. J.W. Kolar he dealt with multi-cell converter systems for different applications, e.g. PV module integrated dc-dc converters, auxiliary supplies for high step-down ratios, and a highly efficient telecom rectifier module. Since January 2017 he is part of the Systems Innovations Lab under Dr. Gerald Deboy. He has authored and coauthored 18 scientific publications and holds 8 international patents.

Andreas Ostmann (1)

Andreas Ostmann

The Opportunities of Integration Technologies for Active and Passive Components

Andreas Ostmann (1)

The Opportunities of Integration Technologies for Active and Passive Components

Andreas Ostmann, born 1966 in Berlin, studied Physics and received his Ph. D. in Micro System Technologies at the Technical University of Berlin. Since he joined Fraunhofer IZM in 1992, his research focus is on advanced packaging technologies. He is head of the department System Integration and Interconnect Technologies. His research group has 25 members and is involved in the developed of large-area processes for chip embedding, System-in-Package and advanced substrates. Andreas is author of a large number of publications and holds several patents on advanced packaging technologies.

Marek S. Rylko (1)

Marek S. Rylko

Challenges and opportunities for magnetic components in the low to medium power applications

SMA Magnetics Sp. z o.o. R&D

Marek S. Rylko (1)

Challenges and opportunities for magnetic components in the low to medium power applications

SMA Magnetics Sp. z o.o. R&D

Since 2010, Marek is associated with SMA Solar Technology A.G. group where he is holding position of the R&D Director at SMA Magnetics Sp. z o.o. The SMA Magnetics is located in Poland and serves as the SMA Group competence center for magnetics. Marek's and his team activity is focused on the research of new technologies and product development.

Members of his team are involved in various activities as PSMA high frequency effects in ferrites, Little Box Challenge supporting OKE-Services with magnetic components. The R&D team was prized the Innovation Award in 2017 for EU funded project “New generation of inductive components for high frequency power electronic converters.”

Marek have completed his Bachelor, Masters and PhD from university of Bielsko-Biała, Silesian Univesity of Technology and University College Cork in 2003, 2004 and 2011, respectively. He is IEEE member and Marie-Curie Fellow. His main interest is in power conversion and magnetic components for power electronics that covers all aspects from the power components to the EMI attenuation. Dr. Rylko is an author and co-author of number of publications in field of magnetics accomplished with 14 patent families. His personal achievements are concluded by William M. Portnoy Award for Split-Winding Integrated Magnetics dc-dc converter.

Karsten Schmidt - Picture

Karsten Schmidt

A low inductive PSiP packaging technology with multilayer ceramic substrate and integrated active cooling

Rogers Germany GmbH

Karsten Schmidt - Picture

A low inductive PSiP packaging technology with multilayer ceramic substrate and integrated active cooling

Rogers Germany GmbH

Karsten is the Platform Innovation Director of Rogers Corporation. His current rule focus to the management of EU innovation projects for Rogers business units with global partners. Previous to this assignment, Karsten was Director of R&D of Rogers business Power Electronics Solution Division and VP of R&D for Curamik Electronics.

He graduated from Technical University at the faculty for glass and ceramic technology in Ilmenau, Germany with a Diploma in precision engineering.

He is author of several publications and patents in DCB and AMB-technology and for Microchannel Cooling in power electronics.

Prof. Katsuaki Suganuma

Prof. Katsuaki Suganuma

WBG power semiconductor packaging with advanced interconnection technologies

ISIR, Osaka University, Japan

Prof. Katsuaki Suganuma

WBG power semiconductor packaging with advanced interconnection technologies

ISIR, Osaka University, Japan

He received the degree of Dr. Engineer from Tohoku University in 1982. He became a research assistant of ISIR (Institute of Scientific and Industrial Research), Osaka University in 1982, an associate professor of National Defense Academy in 1986, and a professor of ISIR of Osaka University in 1996. He was the director of Nanotechnology Center in 2007-2009, the deputy director of ISIR in 2010-2012, and is the director of ISIR from 2018. He has worked on lead-free soldering, conductive adhesive, power electronics packaging and printed electronics. He published about 400 journal papers, 160 reviews and many books on packaging technology such as “Wide Bandgap Power Semiconductor Packaging” in English. He received several awards such as Fularth Pacific Award (1995) and Minister Prize of Economic, Trade and Industry (2012). He has carried out several national projects on packaging technology is currently in charge of Printed electronics standardization IEC TC119 Japan committee (JEITA), Standardization of Thermal Property Evaluation of WBG Power Devices/JFCA, and of the WGB system integration consortium.

 

Huai Wang

Huai Wang

Reliability of capacitors and magnetic components in power electronics applications

Huai Wang

Reliability of capacitors and magnetic components in power electronics applications

Huai Wang is currently an Associate Professor with the Center of Reliable Power Electronics (CORPE), Aalborg University, Denmark, and the Vice Leader of the Efficient and Reliable Power Electronics Research Program. His research addresses the fundamental challenges in modelling and validation of power electronic component failure mechanisms, and application issues in system-level predictability, condition monitoring, circuit architecture, and robustness design. He is a speaker of 20+ tutorials at leading power electronics conferences, and 50+ invited speeches and keynotes.

Prof. Wang received his PhD degree from the City University of Hong Kong, Hong Kong, China, in 2012.  He was a short-term visiting scientist with Massachusetts Institute of Technology (MIT), USA, and ETH Zurich, Switzerland, in 2013 and 2014, respectively. He was with the ABB Corporate Research Center, Baden, Switzerland, in 2009. He received the IEEE PELS Richard M. Bass Outstanding Young Power Electronics Engineer Award, in 2016, for the contribution to the reliability of power electronic conversion systems.  He serves as the Chair of IEEE PELS/IAS/IE Chapter in Denmark.