Overview
| Day | Room MOA 3-5 | Room MOA 5 |
| March 15 | Welcome Greetings - Introduction S1:From Components to Systems | |
| S2: The Quadrilemma of Packaging: Cooling, Parasitics, Insulation and Cost | ||
| S3: Double-Side Cooled Modules | ||
| Get Together | ||
| Room MOA 3-4 | Room MOA 5 | |
| March 16 | S04: Components to be Integrated | S05: Reliability (1) |
| S06: Bonding Materials and Processes | S07: Reliability (2) | |
| S08: Thermal Management | S09: Advanced Packaging Concepts | |
| Poster Session | ||
| Conference Dinner | ||
| Room MOA 3-5 | ||
| March 17 | S10: Reliability (3) | |
| S11: Clean Switching, Electromagnetic Compatibility | ||
| S12: Inverter Design and Integration | ||
Closing Remarks and Awards Ceremony
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