Sarah Rugen + (center module) Semikron
Program
Overview
| Day | Room MOA 3-5 | Room MOA 8 |
March 15 | ||
| Welcome Greetings - Introduction From Components to Systems | ||
| The Quadrilemma of Packaging: Cooling, Parasitics, Insulation and Cost | ||
| Double-Side Cooled Modules | ||
| Inverter Design and Integration | ||
| Get Together | ||
March 16 | ||
| Components to be Integrated | Reliability (1) | |
| Bonding Materials and Processes | Reliability (2) | |
| Thermal Management | Advanced Packaging Concepts | |
| Poster Session | ||
| Conference Dinner | ||
March 17 | ||
| Reliability (3) | ||
| Clean Switching, Electromagnetic Compatibility | ||
| Embedding | ||
| Closing Remarks and Awards Ceremony |
