Overview
Day | Room MOA 3-5 | Room MOA 5 |
March 15 | Welcome Greetings - Introduction S1:From Components to Systems | |
S2: The Quadrilemma of Packaging: Cooling, Parasitics, Insulation and Cost | ||
S3: Double-Side Cooled Modules | ||
Get Together | ||
Room MOA 3-4 | Room MOA 5 | |
March 16 | S04: Components to be Integrated | S05: Reliability (1) |
S06: Bonding Materials and Processes | S07: Reliability (2) | |
S08: Thermal Management | S09: Advanced Packaging Concepts | |
Poster Session | ||
Conference Dinner | ||
Room MOA 3-5 | ||
March 17 | S10: Reliability (3) | |
S11: Clean Switching, Electromagnetic Compatibility | ||
S12: Inverter Design and Integration | ||
Closing Remarks and Awards Ceremony
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