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Overview

DayRoom MOA 3-5Room MOA 5
March 15Welcome Greetings - Introduction 
S1:From Components to Systems


S2: The Quadrilemma of Packaging: Cooling, Parasitics, Insulation and Cost

S3: Double-Side Cooled Modules




Get Together




Room MOA 3-4Room MOA 5
March 16S04: Components to be IntegratedS05: Reliability (1)

S06: Bonding Materials and ProcessesS07: Reliability (2)

S08: Thermal ManagementS09: Advanced Packaging Concepts

Poster Session

Conference Dinner




Room  MOA 3-5
March 17S10: Reliability (3)

S11: Clean Switching, Electromagnetic Compatibility

S12: Inverter Design and Integration

Closing Remarks and Awards Ceremony
  • Best Poster Award
  • ECPE Young Engineer Award for the Best Paper
  • Semikron Innovation & Young Engineer Award


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