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CIPS 2024 | March 12-14 | Düsseldorf, Germany
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CIPS 2024 Düsseldorf: A Dynamic Fusion of Keynotes, Invited Speakers, and Exhibitions in Power Electronics System Integration

The CIPS 2024 event in Düsseldorf not only featured enlightening keynote addresses and insightful presentations from Invited Speakers but also housed a vibrant exhibition, creating a holistic experience for attendees. The exhibition served as a hub for showcasing new products, services, and fostering specialized discussions.

Prof. Rik W. De Doncker's keynote on "Integrated Packaging of Wide Bandgap Power Devices for Ultra-high Power Density DC Converters" set the tone for the event, providing a visionary outlook on pushing the boundaries of power density. Francesco Iannuzzo's keynote, "Large-Scale Adoption of Silicon Carbide in the Automotive Sector: What is Missing?" engaged the audience in discussions about the challenges and opportunities in adopting silicon carbide in automotive applications.

Beyond the keynote sessions, the 10 Invited Speakers added depth and diversity to the discourse, covering a spectrum of topics such as advanced materials, emerging technologies, and innovative design approaches in power electronics system integration. This curated selection of presentations enriched the overall experience, offering attendees a comprehensive understanding of the field's current landscape and future directions.

Complementing the enlightening sessions was the exhibition, where companies showcased their latest products and services in power electronics system integration. The exhibition floor buzzed with activity as professionals engaged in specialized discussions, exchanged ideas, and explored innovative solutions. This interactive space served as a nexus for networking, fostering connections between industry leaders, researchers, and enthusiasts.

The event's meticulous organization ensured a seamless experience for participants, from the state-of-the-art venue to the well-crafted schedule. CIPS 2024 not only celebrated the achievements in power electronics system integration but also provided a platform for the exchange of knowledge and collaboration that will shape the industry's future.

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Thomas Harder, Leo Lorenz, ECPE

Thomas Harder, Leo Lorenz, ECPE
General Chairmen

Nando Kaminski, University of Bremen; Andreas Lindemann, Otto-von-Guericke-University Magdeburg

| VDE

Nando Kaminski, University of Bremen; Andreas Lindemann, Otto-von-Guericke-University Magdeburg
Technical Program Chairmen

Direct Link: cips.eu


Picture: Sarah Rugen + (center module) Semikron